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Effect of BaTiO3 on the microstructure and mechanical properties of Sn1.0Ag0.5Cu lead-free solder

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Abstract

Minor weight fraction of the BaTiO3 particle is doped into the Sn1.0Ag0.5Cu (SAC) lead-free solder by the mechanically mixing. The effect of BaTiO3 on the microstructure and mechanical properties of the SAC lead-free solder is investigated. The results show that the β-Sn is refined and the volume fraction of the eutectic phase is increased by adding BaTiO3. The β-Sn morphology is transformed from the block into the lamellar in the SAC + 0.2 wt% BaTiO3, and a Cu6Sn5 IMC layer with thickness of about 7.3 μm is obtained. The optimal spreadability of the SAC–0.2BaTiO3 is obtained, and the spreading coefficient reaches 0.7836, it is 23.48 % higher than that of the SAC solder. The ultimate tensile strength and the elongation are improved by the BaTiO3 addition. The fracture surface of the SAC–0.2BaTiO3 solder specimen consists of large amounts of dimples due to the highly ductile manner.

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Acknowledgments

This research was financially supported by the National Natural Science Foundation of China (Grant No. 51401037), the Science and Technology Program of Jiangsu Province of China (Grant No. BK20141228), the Science and Technology Program of Suzhou (Grant Nos. SYG201421, SYG201348, and SYG201251), the Natural Science Foundation of the Jiangsu Higher Education Institutions of China (Grant Nos. 14KJB430001 and 13KJB430001), the Scientific Research Project of Changshu Institute of Technology (JXK2014003), and Jiangsu Key Laboratory of Large Engineering Equipment Detection and Control under Grant No. JSKLEDC201301.

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Authors and Affiliations

  1. School of Mechanical Engineering, Changshu Institute of Technology, Changshu, 215500, Jiangsu, People’s Republic of China

    Li Yang, Jinguo Ge, Yaocheng Zhang, Jun Dai & Yanfeng Jing

  2. Jiangsu Key Laboratory of Large Engineering Equipment Detection and Control, Xuzhou Institute of Technology, Xuzhou, 221008, Jiangsu, People’s Republic of China

    Li Yang

  3. School of Materials Science and Engineering, China University of Mining and Technology, Xuzhou, 221008, Jiangsu, People’s Republic of China

    Jinguo Ge & Yanfeng Jing

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  1. Li Yang
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  2. Jinguo Ge
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Correspondence to Li Yang.

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Yang, L., Ge, J., Zhang, Y. et al. Effect of BaTiO3 on the microstructure and mechanical properties of Sn1.0Ag0.5Cu lead-free solder. J Mater Sci: Mater Electron 26, 613–619 (2015). https://doi.org/10.1007/s10854-014-2443-8

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  • DOI: https://doi.org/10.1007/s10854-014-2443-8

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