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Effects of Sn addition on the microstructure and properties of Bi–11Ag high-temperature solder

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Abstract

High-temperature lead-free Bi–11Ag solder with a Sn addition of 1, 3, and 5 wt% was investigated in this paper. The results show that the melting temperature of Bi–11Ag solders dropped from 265 to 255 °C after the addition of Sn, which is suitable for the high-temperature reflow process. When the addition of Sn was 3 wt% or less, dendrites in the microstructure would be refined, however, further additions of Sn show an opposite effect. The contact angle of Bi–11Ag–xSn (x = 0, 1, 3, 5 wt%) solders on the Cu substrate was measured, and the value decreased from 62° to 41° with the increasing of Sn content. The tensile strength of the Cu/Bi–11Ag–xSn solder/Cu sandwich structured microscale solder joint continues to increase from 43.3 to 53.9 MPa and the fracture position evolves from the solder/Cu interface to the middle of solder. In addition, according to EDS analysis of the solder/Cu interface, a Cu3Sn intermetallic compound (IMC) layer can be identified. The combination of this IMC layer and grain boundary grooving at the solder/Cu interface can effectively improve the strength of the Bi–11Ag–xSn solder joint.

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Acknowledgements

This research was supported by the National Natural Science Foundation of China (NSFC) under Grant No. 51674056, the Achievement Transfer Program of Institutions of Higher Education in Chongqing under Grant No. KJZH17137, the Scientific and Technological Research Program of Chongqing Municipal Education Commission under Grant No. KJ1713344, and the State Key Lab of Advanced Welding and Joining, Harbin Institute of Technology under Grant No. AWJ-M15-05.

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Authors and Affiliations

  1. School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, Chongqing, 401331, China

    Limeng Yin, Dong Li, Zongxiang Yao & Gang Wang

  2. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China

    Limeng Yin

  3. Center for Advanced Life Cycle Engineering, University of Maryland, College Park, MD, 20742, USA

    Diganta Das & Michael Pecht

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  1. Limeng Yin
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  2. Dong Li
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Correspondence to Limeng Yin.

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Yin, L., Li, D., Yao, Z. et al. Effects of Sn addition on the microstructure and properties of Bi–11Ag high-temperature solder. J Mater Sci: Mater Electron 29, 12028–12035 (2018). https://doi.org/10.1007/s10854-018-9308-5

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  • DOI: https://doi.org/10.1007/s10854-018-9308-5

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