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Effects of filler shape and size on the properties of silver filled epoxy composite for electronic applications

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Abstract

Epoxy composites filled with nano- and micro-sized silver (Ag) particulate fillers were prepared and characterized based on flexural properties, coefficient of thermal expansion, dynamic mechanical analysis, electrical conductivity, and morphological properties. The influences of these two types of Ag fillers, especially in terms of their sizes and shapes, were investigated. Silver nanoparticles were nano-sized and spherical, while silver flakes were micron-sized and flaky. It was found that the flexural strength of the epoxy composite filled with silver flakes decreased, while the flexural strength of the epoxy composite filled with silver nanoparticles showed an optimum value at 4 vol.% before it subsequently dropped. Both silver composites showed improvement in flexural modulus with increasing filler loads. CTE value indicated significant decrements in filled samples compared to neat epoxy. Results on the electrical conductivity of both systems showed a transition from insulation to conduction at 6 vol.%.

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Acknowledgments

The authors gratefully acknowledge the support from the Research University (Grant 814055) and USM Fellowship. We also thank the School of Materials and Mineral Resources, USM, and its staff for their useful discussions and their help during the experiment.

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Authors and Affiliations

  1. School of Materials and Mineral Resources Engineering, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Seberang Prai Selatan, Penang, Malaysia

    G. Suriati, M. Mariatti & A. Azizan

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  1. G. Suriati
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  2. M. Mariatti
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  3. A. Azizan
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Correspondence to M. Mariatti.

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Suriati, G., Mariatti, M. & Azizan, A. Effects of filler shape and size on the properties of silver filled epoxy composite for electronic applications. J Mater Sci: Mater Electron 22, 56–63 (2011). https://doi.org/10.1007/s10854-010-0082-2

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  • DOI: https://doi.org/10.1007/s10854-010-0082-2

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