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A quantitative approach to study solid state phase coarsening in solder alloys using combined phase-field modeling and experimental observation

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Abstract

In the present work, a quantitative phase-field approach is introduced to study the phase-coarsening phenomena in solder alloys, Pb-Sn alloy here. The most important part of this work is to introduce a simple and versatile approach to quantify the experimental and simulation data, without putting into difficulties corresponding to the stochastic nature of phenomenon, in order to compute unknown physical data required to perform numerical simulation. For this purpose, at first, the evolution of microstructure vs. time is studied experimentally by the conventional optical microscopy. Then, unknown physical data, the interface mobility here, is computed by fitting the time evolution of the total interface perimeter of the simulation results to that of the experimental data. In fact, by this approach, the physical data is computed such that it will be applied to predict reality in the subsequent simulations, i.e., the presented method can be accounted as the calibration of the corresponding mathematical model and numerical method. The validity of the presented approach is supported by comparing simulation data to experimental ones.

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References

  1. Ubachs, R.L.J.M., Schreurs, P.J.G., Geers, M.G.D.: A nonlocal diffuse interface model for microstructure evolution of tin–lead solder. J. Mech. Phys. Solids 52, 1763–1792 (2004)

    Article  MATH  Google Scholar 

  2. Chan, Y., Yang, D.: Failure mechanisms of solder interconnects under current stressing in advanced electronic packages. Prog. Mater. Sci. 55, 428–475 (2010)

    Article  Google Scholar 

  3. Bonda, N., Noyan, I.: Deformation inhomogeneity and representative volume in Pb/Sn solder alloys. Metall. Trans. A, Phys. Metall. Mater. Sci. 23, 479–484 (1992)

    Article  Google Scholar 

  4. Basaran, C.: Measuring intrinsic elastic modulus of Pb/Sn solder alloys. J. Jiang Mech. Mater. 34, 349–362 (2002)

    Article  Google Scholar 

  5. Hacke, P., Sprecher, A., Conrad, H.: Microstructure coarsening during thermo-mechanical fatigue of Pb–Sn solder joints. J. Electron. Mater. 26, 774–782 (1998)

    Article  Google Scholar 

  6. Conrad, H., Guo, Z., Fahmy, Y., Yang, D.: Influence of microstructure on the plastic deformation kinetics, fatigue crack growth rate, and low-cycle fatigue of solder joints. J. Electron. Mater. 28, 1062–1070 (1999)

    Article  Google Scholar 

  7. Jung, K., Conrad, H.: Microstructure coarsening during static annealing of 60Sn40Pb solder joints: I stereology. J. Electron. Mater. 30, 1294–1302 (2001)

    Article  Google Scholar 

  8. Jung, K., Conrad, H.: Microstructure coarsening during static annealing of 60Sn40Pb solder joints: II eutectic coarsening kinetics. J. Electron. Mater. 30, 1303–1307 (2001)

    Article  Google Scholar 

  9. Matin, M., Vellinga, W., Geers, M.: Quantitative Microscopy of Microstructural Evolution in Eutectic Solders Subjected to Static Thermal Load, pp. 111–116. Shaker Publishing, Aix-en-Provence (2003)

    Google Scholar 

  10. Cahn, J.W., Hilliard, J.E.: Free energy of a nonuniform system I: interfacial free energy. J. Chem. Phys. 28, 258–267 (1957)

    Article  Google Scholar 

  11. Cahn, J.W.: Spinodal decomposition. Trans. Metall. Soc. AIME 242, 166–180 (1968)

    Google Scholar 

  12. Dreyer, W., Muller, W.H.: A study of the coarsening in tin/lead solders. J. Mater. Sci. 37, 3841–3871 (2000)

    MATH  Google Scholar 

  13. Dreyer, W., Wagner, B.: Sharp-interface model for eutectic alloys part I: concentration dependent surface tension. Interfaces Free Bound 5, 199–227 (2005)

    Article  MathSciNet  Google Scholar 

  14. Böhme, T., Dreyer, W., Müller, W.H.: Determination of stiffness and higher gradient coefficients by means of the embedded-atom method. Contin. Mech. Thermodyn. 18, 411–441 (2007)

    Article  MATH  MathSciNet  Google Scholar 

  15. Boettinger, W.J., Warren, J.A., Beckermann, C., Karma, A.: Phase field simulation of solidification. Annu. Rev. Mater. Res. 32, 163–194 (2002)

    Article  Google Scholar 

  16. Muller, W.: Changes in solder joints-experimental evidence and physical understanding. Microelectron. Reliab. 44, 1901–1914 (2004)

    Article  Google Scholar 

  17. Dreyer, W., Muller, W.H.: Modeling diffusional coarsening in eutectic tin/lead solders: a quantitative approach. Int. J. Solids Struct. 38, 1433–1458 (2001)

    Article  MATH  Google Scholar 

  18. Cox, S.M., Matthews, P.C.: Exponential time differencing for stiff systems. J. Comput. Phys. 176, 430–455 (2002)

    Article  MATH  MathSciNet  Google Scholar 

  19. Kassam, A., Trefethen, L.N.: Fourth-Order time stepping for stiff PDEs. SIAM J. Sci. Comput. 26, 1214–1233 (2005)

    Article  MATH  MathSciNet  Google Scholar 

  20. Brenier, Y., Otto, F., Seis, C.: Upper bounds on coarsening rates in demixing binary viscous liquids. J. Soc. Ind. Appl. Math. 43, 114–134 (2011)

    MATH  MathSciNet  Google Scholar 

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Correspondence to Mohammad Mahdi Tavakoli.

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Tavakoli, M.M., Tavakoli, R., Davami, P. et al. A quantitative approach to study solid state phase coarsening in solder alloys using combined phase-field modeling and experimental observation. J Comput Electron 13, 425–431 (2014). https://doi.org/10.1007/s10825-013-0551-y

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  • DOI: https://doi.org/10.1007/s10825-013-0551-y

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