Abstract
A multiscale simulation method is established to study the microstructural responses of near-surface grain boundary structures of copper subjected to ultrashort femtosecond laser pulse. By integrating a two-temperature model with molecular dynamics, the presented approach allows for incorporation of both laser processing parameters and microstructures, enabling systematic simulation studies on the process-properties link. Following a brief introduction of the simulation methodology, a detailed modeling study on the ultrashort laser-material interaction is presented. In particular, we highlight the effects of laser process parameters on the near-surface response and corresponding phase change, formation of voids and their growth, and mechanism of dislocation nucleating and propagating from grain boundary.
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Acknowledgements
The authors gratefully acknowledge the support from the National Science Foundation (Grant Nos. # DMR-0706161, CMMI-1335204, 1334538). Any opinions, findings, conclusions, or recommendations expressed in these documents are those of the authors and do not necessarily reflect the views of the NSF. This work was also supported in part by the start-up fund from the University of Texas at Dallas and an allocation of computing time from the Ohio Supercomputer Center and Texas Advanced Computing Center.
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Karim, M.R., Kattoura, M., Mannava, S.R. et al. A computational study on the microstructural evolution in near-surface copper grain boundary structures due to femtosecond laser processing. Comput Mech 61, 105–117 (2018). https://doi.org/10.1007/s00466-017-1449-5
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DOI: https://doi.org/10.1007/s00466-017-1449-5