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Laser-induced etching of silicon

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Abstract

Conventional fabrication method of porous silicon is anodisation of single crystal silicon in hydrofluoric acid. In this report, we show that it is possible to fabricate porous silicon by laser-induced etching. An earlier report by us has demonstrated the dependence of porous silicon photoluminescence characteristic on the etching laser wavelength [1]. Here we used 780 nm line from a diode laser as the etching source, and the optimum etching conditions were obtained. A simple model was proposed to explain the etching process. Scanning Electron Microscope (SEM) images of the samples support the proposed process.

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Correspondence to K. W. Cheah.

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Choy, C.H., Cheah, K.W. Laser-induced etching of silicon. Appl. Phys. A 61, 45–50 (1995). https://doi.org/10.1007/BF01538209

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  • DOI: https://doi.org/10.1007/BF01538209

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