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Influence of Soldering Temperature on Microstructure and Thermal Properties of FC-LED Filaments Soldered with SAC0307

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Abstract

The influence of the soldering temperature on the performance of flip-chip light-emitting diodes (FC-LED) filaments soldered with SAC0307 has been investigated. Scanning electron microscopy (SEM) images, void rates, shearing force, junction temperature, steady-state voltage, blue light luminous flux, and luminous efficiency were measured to characterize the filament performance. The microstructure of the fracture surface after shear failure of the FC-LED filament joints soldered at 250°C and 270°C showed the lowest percentage of voids and was smoother than for the other groups. The shearing force of the FC-LED filament solder joints formed at 250°C and 270°C was higher than that for the other three groups, but the shearing force of all five groups of solder joints exceeded 200 gf. The steady-state voltage and junction temperature of the 250°C and 270°C FC-LED filaments were lower than those of the other three groups, and the blue light luminous flux of the 250°C and 270°C FC-LED filaments was higher than for the other three groups. In conclusion, the FC-LED filaments exhibited good photoelectric performance and thermal reliability when using soldering temperatures between 250°C and 270°C.

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Acknowledgments

This work was supported by the Science and Technology Planning Project of Zhejiang Province, China (2018C01046), Enterprise-funded Latitudinal Research Projects (J2016-141, J2017-171, J2017-293, and J2017-243).

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Authors and Affiliations

  1. School of Science, Shanghai Institute of Technology, Shanghai, 201418, China

    Chengyu Guan, Jun Zou, Huizi Liu, Qing Lu,  BoboYang & Mingming Shi

  2. School of Materials Science and Engineering, Shanghai Institute of Technology, Shanghai, 201418, China

    Yang Li

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  1. Chengyu Guan
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  2. Jun Zou
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  3. Huizi Liu
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  4. Qing Lu
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  5. Yang Li
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Correspondence to Jun Zou or Yang Li.

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Guan, C., Zou, J., Liu, H. et al. Influence of Soldering Temperature on Microstructure and Thermal Properties of FC-LED Filaments Soldered with SAC0307. J. Electron. Mater. 50, 4186–4195 (2021). https://doi.org/10.1007/s11664-021-08957-x

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