Abstract
Solid-state bonding experiments, between Alumina and Inconel 600 without interlayers, are carried out at temperatures ranging from 1100°C to 1300°C under Argon at a pressure of 100 MPa for 30 min. to 120 min. using the hot-isostatic pressing (H.I.P.) technique. Optimal bonding conditions are assessed by shear testing at room temperature. Strengths up to about 70 MPa are obtained with fracture primarily occuring within the Alumina.
The critical problem of residual stresses resulting from the thermal expansion mismatch between Alumina and Inconel 600 has also been examined with regard to the thickness of both materials. The effects of components size on the residual stresses within the ceramic are calculated using a finite element method (F.E.M.). On the basis of the results of calculation, Alumina and Inconel 600 are bonded at 1300°C under 100 MPa for 60 min. The observations on crack close to the interface or at the upper ceramic surface, for the various geometries, correlate rather well with residual stresses computed by the elasto-plastic model.
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© 1991 Elsevier Science Publishers Ltd
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Colin, C., Koutny, J.L., Bienvenu, Y. (1991). Diffusion bonding of Inconel 600 to Alumina. In: Stephenson, D.J. (eds) Diffusion Bonding 2. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-3674-7_17
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DOI: https://doi.org/10.1007/978-94-011-3674-7_17
Publisher Name: Springer, Dordrecht
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