Joining of silicon nitride to silicon nitride and to Invar alloy using an aluminium interlayer

Abstract

Si₃N₄ has been bonded to Si₃N₄ and to the Invar alloy using an aluminium interlayer at temperatures above the melting point of aluminium. Reaction was hardly observed at the interface between Si₃N₄ and aluminium up to 1223 K. The highest strength of the Si₃N₄-Al-Si₃N₄ joints was beyond 500 M Pa. In the Si₃N₄-Al-Invar joint, two main intermetallic compound layers were formed at the AI-Invar interface. The strength of the joints was between 150 and 200 MPa. It is expected that the aluminium layer and the reaction layer with the fine cracks growing perpendicular to the interface play an important role to compensate for the thermal expansion mismatch.