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Correction to: Chapter 9 in: K. S. Siow (ed.), Die-Attach Materials for High Temperature Applications in Microelectronics Packaging, https://doi.org/10.1007/978-3-319-99256-3_9
The original version of the book was inadvertently published with an incorrect phrase stating “Need more here. Combine with above?” in Page 237 under Section 8.1.3 Au-In. This phrase has been corrected to show “At low temperatures, Au-In forms seven IMC phases between Au and In, with AuIn2, AuIn, and Au7In3 observed in the reaction zone between Au and In even at the shortest reaction times [84].”
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Holaday, J.R., Handwerker, C.A. (2019). Correction to: Transient Liquid Phase Bonding. In: Siow, K. (eds) Die-Attach Materials for High Temperature Applications in Microelectronics Packaging. Springer, Cham. https://doi.org/10.1007/978-3-319-99256-3_11
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DOI: https://doi.org/10.1007/978-3-319-99256-3_11
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Publisher Name: Springer, Cham
Print ISBN: 978-3-319-99255-6
Online ISBN: 978-3-319-99256-3
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