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Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging

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Nano-Bio- Electronic, Photonic and MEMS Packaging

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Abstract

Lead-free solder, tin, tin/silver (SnAg), and tin/silver/copper (SnAgCu) alloy nanoparticles with various sizes were synthesized via a low-temperature chemical reduction method, and their thermal properties were studied by differential scanning calorimetry. The particle size dependency of the melting temperature and the latent heat of fusion were observed. The wetting test for the as-prepared SnAg and SnAgCu alloy nanoparticle pastes on a Cu surface showed the typical Cu6Sn5 intermetallic compound (IMC) formation. These low melting point SnAg or SnAgCu alloy nanoparticles could be used for low reflow temperature lead-free interconnect applications.

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Author information

Authors and Affiliations

  1. Intel Corporation, Chandler, AZ, USA

    Hongjin Jiang

  2. School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, USA

    Kyoung-sik (Jack) Moon & C. P. (Ching-Ping) Wong

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  1. Hongjin Jiang
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  2. Kyoung-sik (Jack) Moon
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  3. C. P. (Ching-Ping) Wong
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Editor information

Editors and Affiliations

  1. School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, GA, USA

    C. P.(Ching-Ping) Wong

  2. School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, GA, USA

    Kyoung-sik (Jack) Moon

  3. Intel Corp., Chandler, AZ, USA

    Yi Li

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Jiang, H., Moon, Ks.(., Wong, C.P.(P. (2021). Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging. In: Wong, C.PP., Moon, Ks.(., Li, Y. (eds) Nano-Bio- Electronic, Photonic and MEMS Packaging. Springer, Cham. https://doi.org/10.1007/978-3-030-49991-4_5

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