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Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips

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Nano-Bio- Electronic, Photonic and MEMS Packaging

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Abstract

In the last two decades, fundamental and application-driven research on microfluidics and bio-micro-electro-mechanical systems (BioMEMS) has flourished in academia and industries and has begun to make impact on medicine and bio-sciences. Packaging of these systems is an integral if not critical part of the device/system design and function. Because the applications and the designs of the chips are wide ranging, it is difficult to achieve a universal packaging scheme that meets the requirements of all applications. Instead, research and manufacturing practices of each type of biochip have come up with specialty techniques. This chapter will review these techniques in the specific contexts of the chip applications, as well as materials requirements. In addition, we will highlight common and advanced practices and point out research needs in these areas.

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  1. School of Chemical Biomolecular Engineering, Georgia Institute of Technology, Atlanta, GA, USA

    Edward S. Park, Jan Krajniak & Hang Lu

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  1. Edward S. Park
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  1. School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, GA, USA

    C. P.(Ching-Ping) Wong

  2. School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, GA, USA

    Kyoung-sik (Jack) Moon

  3. Intel Corp., Chandler, AZ, USA

    Yi Li

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Park, E.S., Krajniak, J., Lu, H. (2021). Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips. In: Wong, C.PP., Moon, Ks.(., Li, Y. (eds) Nano-Bio- Electronic, Photonic and MEMS Packaging. Springer, Cham. https://doi.org/10.1007/978-3-030-49991-4_12

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