Overview
- Includes in-depth discussion on special reliability testing of advanced memory packages
- Provides an holistic overview of interconnect materials, packaging processes in advanced memory packaging
- Explains comprehensive materials reliability in memory device packaging
Part of the book series: Springer Series in Reliability Engineering (RELIABILITY)
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About this book
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.
In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.
This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
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Keywords
Table of contents (8 chapters)
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Front Matter
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Back Matter
Authors and Affiliations
Bibliographic Information
Book Title: Interconnect Reliability in Advanced Memory Device Packaging
Authors: Chong Leong, Gan, Chen-Yu, Huang
Series Title: Springer Series in Reliability Engineering
DOI: https://doi.org/10.1007/978-3-031-26708-6
Publisher: Springer Cham
eBook Packages: Engineering, Engineering (R0)
Copyright Information: The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Switzerland AG 2023
Hardcover ISBN: 978-3-031-26707-9Published: 29 April 2023
Softcover ISBN: 978-3-031-26710-9Due: 30 May 2023
eBook ISBN: 978-3-031-26708-6Published: 28 April 2023
Series ISSN: 1614-7839
Series E-ISSN: 2196-999X
Edition Number: 1
Number of Pages: XVIII, 210
Number of Illustrations: 11 b/w illustrations, 89 illustrations in colour
Topics: Computer Hardware, Circuits and Systems