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Specific Packaging Reliability Testing

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Interconnect Reliability in Advanced Memory Device Packaging

Part of the book series: Springer Series in Reliability Engineering ((RELIABILITY))

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Abstract

In the past 5 years, advanced Silicon node and packaging technology are significantly driven by the growing market on 5G applications, high performance computing (HPC), internet of thing (IoT) and electronics in autonomous vehicle.

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Authors and Affiliations

  1. Package Development Engineering, Micron Memory Taiwan Co. Ltd., Taichung, Taiwan

    Chong Leong, Gan & Chen-Yu, Huang

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  1. Chong Leong, Gan
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  2. Chen-Yu, Huang
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Correspondence to Chong Leong, Gan .

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Gan, C.L., Huang, CY. (2023). Specific Packaging Reliability Testing. In: Interconnect Reliability in Advanced Memory Device Packaging. Springer Series in Reliability Engineering. Springer, Cham. https://doi.org/10.1007/978-3-031-26708-6_6

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  • DOI: https://doi.org/10.1007/978-3-031-26708-6_6

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-031-26707-9

  • Online ISBN: 978-3-031-26708-6

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