Conductivities and curing properties of electron-beam-irradiated anisotropic conductive films

Abstract

Radiation-curable acrylated epoxy oligomer was irradiated by using an electron beam (E-beam) with dosages of 5, 10, 20, 40, 80, 200, 400, and 550 kGy to investigate the electrical and the physical properties of anisotropic conductive films (ACFs) and to evaluate the potential application of radiation technology to flip-chip package processing. An ACF is an insulating epoxy matrix containing conducting particles that keep the electrical conductivity along the out-of-plane direction and the insulation property along the in-plane direction. The contact resistance between ACF joints cured by using an E-beam irradiation of 80 kGy was measured under a constant bonding pressure of 2 kgf/cm² to demonstrate the effects of pad pitch size and the number of added conductive particles in the epoxy resin. Three types of PCBs, 1000-, 500-, and 100-µm pad pitches, were employed while the E-beam curable epoxy resin was mixed with conductive particles in a weight ratio of 10:1. The measured average contact resistance was 0.24 Ω with a minimum of 0.06 Ω for the samples prepared with a 100-µm pad pitch size, which is compatible with or lower than the values obtained from thermally-cured commercial ACFs. Our results demonstrate that an E-beam is an effective radiation method for curing epoxy resins at low temperatures in a short time and can be employed as a new technique for bonding circuits in high-density electric devices.