Abstract
The benefits of laser drilling and cutting to make holes in metals have been demonstrated. Calculated data regarding temperature and residual thermal stresses under conventional and immersion laser cutting are given.
Similar content being viewed by others
REFERENCES
Kondratenko, V.S., Naumov, A.S., and Velikovskiy, I.E., Taiwan Patent no. 107129739, 2018.
Kondratenko, V.S., Lu, H.-T., Naumov, A.S., and Velikovskiy, I.E., Laser cutting of Taiko silicon substrates, Prikl. Fiz., 2020, no. 1, pp. 71–74.
Lu, H.-T., Kondratenko, V.S., Naumov, A.S., Velikovskii, I.E., and Zobov, A.K., New technology of laser cutting of silicon substrates Taiko, Sbornik dokladov konferentsii Opticheskie tekhnologii, materialy i sistemy (Optotekh-2019) (Proc. Conf. on Optical Technologies, Materials, and Systems, Optotekh-2019), Kondratenko, V.S., Ed., Moscow: MIREA–Ross. Tekhnol. Univ., 2019, pp. 16–24.
Murakami, R., Nakagawa, H., and Matsuo, S., Water-assisted laser drilling for miniature internal thread in glass and evaluation of its strength, J. Laser Micro Nanoeng., 2017, vol. 12, no. 3, pp. 203–206.
Arai, Ya., Sako, T., and Takebayashi, Yo., Supercritical Fluids: Molecular Interactions, Physical Properties and New Applications, Springer Series in Materials Processing, Berlin: Springer, 2002. https://doi.org/10.1007/978-3-642-56238-9
ACKNOWLEDGMENTS
The author is sincerely grateful to the staff of the Institute of Physics and Technology of the Russian Technological University MIREA: V.S. Kondratenko (Professor, Doctor of Technical Sciences) and V.V. Kadomnin (Associate Professor, PhD in Technical Sciences) for participation in the formulation of the problem and discussion of the research results.
Author information
Authors and Affiliations
Corresponding author
Ethics declarations
The author declares that he has no conflicts of interest.
Additional information
Translated by N. Saetova
About this article
Cite this article
Albagachiev, A.Y. Residual Thermal Stresses under Immersion Laser-Hole Cutting of Metals. J. Mach. Manuf. Reliab. 52, 210–213 (2023). https://doi.org/10.3103/S1052618823030032
Received:
Revised:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.3103/S1052618823030032