Abstract
Spherical Sn0.3Ag0.7Cu (wt.%) solder droplets with diameter ranging from 70.6 to 334.0 ώm were prepared using pulsated orifice ejection method. Compared with conventional atomization, these droplets are almost completely spherical with a much narrower size distribution. The surface of these droplets is smooth without detectable satellite particles. Furthermore, both the composition and microstructure are homogenous throughout any single droplet regardless of their size. Detailed microstructural analysis shows that nano-sized Ag3Sn particles are distributed homogenously in the β-Sn matrix. The results suggest that the droplets have advantage as electronic packaging material and be a promising candidate material for three-dimensional printing.
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ACKNOWLEDGMENTS
This work is supported by Program for Professor of Special Appointment (Eastern Scholar) at Shanghai Institutions of Higher Learning (No. TP2014042), People’s Republic of China, the National Natural Science Foundation of China (Numbers 51171105 and 51671123), Natural Science Foundation of Liaoning Province (No. 2013020114), 085 project in Shanghai University, People’s Republic of China, and Open Fund of Shanghai Key Laboratory of Digital Manufacture for Thin-walled Structures, People’s Republic of China.
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Zhao, B., Dong, W., Ji, H. et al. Highly spherical, mono-sized SnAgCu droplets by pulsated orifice ejection method. MRS Communications 7, 709–714 (2017). https://doi.org/10.1557/mrc.2017.65
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DOI: https://doi.org/10.1557/mrc.2017.65