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Microalloying effects of Sb and Ag on the microstructural evolution of eutectic Sn–Bi alloys

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Abstract

The low melting temperature of eutectic Sn–Bi alloys (139 °C) makes eutectic Sn–Bi a suitable low temperature alternative to high-Sn, lead-free solders in electronics packaging. The low eutectic temperature allows for a peak reflow temperature of 180 °C rather than the 240 °C reflow temperature required for Sn–Ag–Cu alloys. Lower reflow temperatures reduce warpage-induced solder joint defects. However, the strain-rate sensitivity of Sn-Bi alloys results in lower drop-shock performance despite having higher reliability in thermal cycling. The literature shows evidence in bulk solders that microalloying with Sb and Ag can improve ductility and mitigate the strain-rate sensitivity of Sn–Bi alloys. Improved ductility and a low strain-rate sensitivity are known to enhance drop-shock performance and create a more reliable joint. Our results demonstrate how small changes in composition due to Cu-dissolution from substrates make the microstructure more heterogeneous and how those changes impact the mechanical properties of Sn–Bi solder joints.

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Acknowledgments

This work was supported by the Semiconductor Research Corporation (SRC). We gratefully acknowledge helpful discussions with Yaohui Fan, Yifan Wu, Ganesh Subbarayan, and David Bahr of Purdue. The EPMA-WDS images were obtained with the assistance of Will Nachlas at University of Wisconsin-Madison. This work was supported in part by the Research Instrumentation Center in the Department of Chemistry at Purdue University. We acknowledge support from the U.S. Department of Defense [Contract No. W52P1J-22-9-3009]. The views and conclusions contained in this document are those of the authors and should not be interpreted as representing the official policies, either expressed or implied, of the U.S. Department of Defense or the U.S. Government. The U.S. Government is authorized to reproduce and distribute reprints for Government purposes, notwithstanding any copyright notation here on.

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  1. College of Engineering, Purdue University, West Lafayette, IN, USA

    Hannah N. Fowler, Sui Xiong Tay, John Blendell & Carol A. Handwerker

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  1. Hannah N. Fowler
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  2. Sui Xiong Tay
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Correspondence to Hannah N. Fowler.

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Fowler, H.N., Tay, S.X., Blendell, J. et al. Microalloying effects of Sb and Ag on the microstructural evolution of eutectic Sn–Bi alloys. MRS Advances 8, 763–767 (2023). https://doi.org/10.1557/s43580-022-00472-3

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