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Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization

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Abstract

An Sn-patch formed in Ni(V)-based under bump metallization during reflow and aging. To elucidate the evolution of the Sn-patch, the detailed compositions and microstructure in Sn-Ag-Cu and Ti/Ni(V)/Cu joints were analyzed by a field emission electron probe microanalyzer (EPMA) and transmission electron microscope (TEM), respectively. There existed a concentration redistribution in the Sn-patch, and its microstructure also varied with aging. The Sn-patch consisted of crystalline Ni and an amorphous Sn-rich phase after reflow, whereas V2Sn3 formed with amorphous an Sn-rich phase during aging. A possible formation mechanism of the Sn-patch was proposed.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, 300, Taiwan

    Kai-Jheng Wang, Yan-Zuo Tsai, Jenq-Gong Duh & Toung-Yi Shih

  2. United Microelectronics Corporation, Hsinchu, 300, Taiwan

    Toung-Yi Shih

Authors
  1. Kai-Jheng Wang
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  2. Yan-Zuo Tsai
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  3. Jenq-Gong Duh
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  4. Toung-Yi Shih
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Correspondence to Jenq-Gong Duh.

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Wang, KJ., Tsai, YZ., Duh, JG. et al. Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization. Journal of Materials Research 24, 2638–2643 (2009). https://doi.org/10.1557/jmr.2009.0315

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  • DOI: https://doi.org/10.1557/jmr.2009.0315

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