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Effect of soldering time on the microstructure and mechanical properties of SnBi/SACBN/Cu solder joint

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Abstract

To improve the mechanical properties of SnBi solder joints, Sn–Ag–Cu–Bi–Ni (SACBN) bumps were pre-soldered on the Cu pads, and thus the SnBi/SACBN/Cu solder joints were obtained in this work. By comparing with SnBi/Cu, the effects of soldering time on the microstructure and mechanical properties of SnBi/SACBN/Cu solder joint were investigated. Experimental results show that increasing soldering time suppresses the composition segregation in SnBi bulk, but it leads to the coarsening of β-Sn and Bi-rich phases. As the soldering time increases, the interfacial IMC layers in the SnBi/Cu and the SnBi/SACBN/Cu solder joints gradually become thicker. The growth of the (Cu, Ni)6Sn5 interfacial IMC in SnBi/SACBN/Cu is mainly based on solid–solid diffusion. Its growth rate is lower than that of the IMC whose growth is dominantly due to liquid–solid diffusion in SnBi/Cu. The addition of SACBN bulk decreases the hardness of the SnBi bulk. Meanwhile, the hardness shows a decreasing trend as the soldering time increases. When the soldering time is 40 s and 160 s, SACBN bulk suppresses the propagation of fracture in SnBi bulk and improves the shear strength of the solder joint. As the soldering time reaches 280 s, the shear strength of the SnBi/SACBN/Cu solder joint decreases, and the fracture is mainly located in the SnBi bulk.

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Data availability

The datasets generated during and/or analyzed during the current study are available from the corresponding author on reasonable request.

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Funding

The authors declare that no funds, grants, or other support were received during the preparation of this manuscript.

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Authors and Affiliations

  1. College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, 225127, People’s Republic of China

    Yang Liu, Jian Chang, Yuxiong Xue, Rongxing Cao, Hongxia Li, Shu Zheng & Xianghua Zeng

  2. Energy and Environment Engineering Institute, Nanchang Institute of Technology, Nanchang, 330044, China

    Yang Liu

  3. School of Material Science and Engineering, Harbin University of Science and Technology, Harbin, 150040, People’s Republic of China

    Jian Chang

Authors
  1. Yang Liu
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  2. Jian Chang
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  3. Yuxiong Xue
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  4. Rongxing Cao
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  5. Hongxia Li
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  6. Shu Zheng
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  7. Xianghua Zeng
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Contributions

YL: conceptualization, methodology, investigation, and writing—review & editing. JC: investigation, writing—original draft. YX: supervision. RC: investigation. HL: review & editing. SZ: review & editing. XZ: supervision.

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Correspondence to Yuxiong Xue.

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Liu, Y., Chang, J., Xue, Y. et al. Effect of soldering time on the microstructure and mechanical properties of SnBi/SACBN/Cu solder joint. J Mater Sci: Mater Electron 33, 8270–8280 (2022). https://doi.org/10.1007/s10854-022-07981-9

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  • DOI: https://doi.org/10.1007/s10854-022-07981-9

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