Abstract
Surface modification of polyimides has been used to obtain better interaction with an inorganic material. Copper sulfide incorporation onto the surface of commercial Kapton® polyimide showed that treatment with base was necessary for adherence of the copper sulfide to the polymeric matrix. The optimized conditions for composite preparation, obtained by response surface methodology, was pH 1.4 at 80 °C for 3.67 h. Using these conditions, we obtained electrical resistance as low as 1.0 ohm for CuS\Kapton® composites. These optimized conditions were used to prepare other low-resistance polyimide composites. The resulting composites were analyzed by photoelectron spectroscopy. The presence of S(2p) and Cu(2p) peaks demonstrated the incorporation of copper sulfide onto the polyimide surface. Scanning electron microphotographs and the images from atomic force microscopy showed a homogeneous CuS distribution in all composites.
Similar content being viewed by others
References
A.M. Wilson . Thin Solid Films 83, 145 (1981).
C.J. Bartlet, J.M. Segelken, and N.A. Teneketges . IEEE Trans. Compon. Hybrids. Manuf. Technol. 12, 637 (1987).
D. Wilson, H.D. Stenzenberger, and P.M. Hergenrother . Polyimides, edited by D. Wilson, H.D. Stenzenberger, and P.M. Hergenrother (Blackie & Son, Glasgow, United Kingdom, 1990).
D-Y. Shih, J. Paraszczak, N. Klymko, R. Flitsch, S. Nunes, J. Lewis, C. Yang, J. Cataldo, R. McGouey, W. Graham, R. Serino, and E. Galligan, J. Vac. Sci. Technol., A. 7, 1402 (1989).
T. Strunskus, M. Grunze, G. Kochendoerfer, and C.H. Wöll, Langmuir 12, 2712 (1996).
K.W. Lee, S.P. Kowalczyk, and J.M. Shaw, Macromolecules 23, 2097 (1990).
K.W. Lee, S.P. Kowalczyk, and J.M. Shaw, Langmuir 7, 2450 (1991).
N.C. Stoffel, M. Hsieh, S. Chandra, and E.J. Kramer, Chem. Mater. 8, 1035 (1996).
T. Yamamoto, K. Tanaka, E. Kubota, and K. Osakada, Chem. Mater. 5, 1352 (1993).
H. Hu, J. Campos, and P.K. Nair, J. Mater. Res. 11, 739 (1996).
D.C. Montgomery, Design and Analysis of Experiments, 4th ed. (John Wiley & Sons, New York, 1997).
B. Barros Neto, I.S. Scarminio, and R.E. Bruns, Design and Optimization of Experiments (Unicamp, Campinas, Brazil, 1995).
A.F. Rubira, L.T. Taylor, J.D. Rancourt, A.K. St. Clair, and D.M. Stoakley, J. Mater. Sci.: Pure Appl. Chem. A 35, 621 (1998).
M. Navarre, in Polyimides: Synthesis, Characterization, and Ap-plications, edited by K.L. Mittal (Plenum Press, New York, 1984), pp. 438–439.
R.M. Silverstein, G.C. Bassler, and T.C. Morril, Spectrometric Identification of Organic Compounds, 4th ed. (John Wiley & Sons, New York, 1981).
H. Ishida, S.T. Wellinghoff, E. Boer, and J.L. Koenig, Macromolecules 13, 826 (1980).
J.L. Koenig, Spectroscopy of Polymers (Amer. Chem. Soc., Washington, DC, 1993).
F.J. Boerio, J.T. Young, and W.W. Zhao, in Multidimensional Spectroscopy of Polymers (Amer. Chem. Soc., Washington, DC, 1995).
H.J. Leary and D.S. Campbell, Surf. Interface Anal. 1, 75 (1979).
J. Russat, Surf. Interface Anal. 11, 414 (1988).
H.J. Leary and D.S. Campbell, in Photon, Electron and Ion Probes of Polymer Structure and Properties, edited by D.W. Dwight, T.J. Fabish, and H.R. Thomas (Amer. Chem. Soc., Washington, DC, 1981).
J.R. Salem, F.O. Sequeda, J. Duran, W.Y. Lee, and R.M. Yang, J. Vac. Sci. Technol. A 3, 739 (1985).
D.T. Clark and H.R. Thomas, J. Polym. Sci., Polym. Chem. Ed. 16, 791 (1978).
B.D. Silverman, P.N. Sanda, and P.S. Ho, J. Polym. Sci., Polym. Chem. Ed. 23, 2857 (1985).
P.L. Buchwalter and A.I. Baise, in Polyimides: Synthesis, Characterization, and Applications, edited by K.L. Mittal (Plenum Press, New York, 1984).
C.D. Wagner, W.M. Riggs, L.E. Davis, J.F. Moudler, and G.E. Muilemberg, Handbook of X-Ray Photoelectron Spectroscopy (Perkin-Elmer, Edima, MN, 1978).
S. Strauss and A. Wall, J. Res. Natl. Bur. Stand., Sect. A 63, 269 (1959).
K.S. Sengupta and H.K. Birnbaum, J. Vac. Sci. Technol. A 9, 2928 (1991).
W.C. Stewart, J. Leu, and K.F. Jensem, in Interfaces between Polymers, Metals and Ceramics, edited by B.J. DeKoven, A.J. Gellman, and R. Rosemberg (Mater. Res. Soc. Symp. Proc. 153, Pittsburgh, PA, 1989), pp. 285–290.
C.E. Sroog, J. Polym. Sci. 11, 161 (1976).
T. Yamamoto, A. Taniguchi, K. Kubota, and Y. Tominaga, Inorg. Chim. Acta 104, L1 (1985).
S. Dev, A. Taniguchi, T. Yamamoto, K. Kubota, and Y. Tominaga, Colloid Polym. Sci. 265, 922 (1987).
A.J. Pertsin and Y.M. Pashunin, Appl. Surf. Sci. 47, 115 (1991).
M. Romand, M. Roubin, and J.P. Deloume, J. Electron Spectrosc. Relat. Phenom. 13, 229 (1978).
H. Tu and J. Wang, Polym. Degrad. Stab. 54, 195 (1996).
S. Bahadur and D. Gong, Wear 162–164, 397 (1993).
G. Schö, Surf. Sci. 35, 96 (1973).
T.N. Vorob’eva, Polym. Sci. 36, 1240 (1994).
JCPDS Database, No. 6-0464.
H. Grijalva, M. Inoue, S. Boggavarapu, and P. Calvert, J. Mater. Chem. 6, 1157 (1996).
I. Grozdanov and M. Najdoski, J. Solid State Chem 114, 469 (1995).
M. Küpper and J.W. Schultze, J. Electroanal. Chem. 427, 129 (1997).
C. Feger and R. Saraf, in Advances in Polyimide Science and Technology, edited by C. Feger, M. Khojasteh, and M.S. Htoo (Technomic Publishing, New York, 1991).
A.F. Rubira, J.D. Rancourt, M.L. Caplan, A.K. St. Clair, and L.T. Taylor, Chem. Mater. 6, 2351 (1994).
M.M.J. Treacy, T.W. Ebbesen., and J.M. Gibson., Nature 381, 678 (1996).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Rowe, R.V.A., Kunita, M.H., Porto, M.F. et al. Low-resistance films of polyimides with impregnated copper sulfide. Journal of Materials Research 16, 3097–3106 (2001). https://doi.org/10.1557/JMR.2001.0427
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1557/JMR.2001.0427