Skip to main content
SpringerLink
Log in

Adhesives for assembly on printed-circuit boards

  • Published:
Polymer Science Series C Aims and scope Submit manuscript

Abstract

Requirements for adhesives used in the surface-mount technique are presented. Properties of a heat-setting epoxy adhesive TPK-4 designed at the Semenov Institute of Chemical Physics of the Russian Academy of Sciences together with the OOO NPF Tekhpolikom are described.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. A. V. Lukin, A. N. Parfenov, L. I. Anikhovskaya, and V. K. Skachkova, Elektron. Komponenty, No. 7 (2000).

  2. A. N. Parfenov, Elektron. Komponenty, No. 4 (1999).

  3. S. R. Rut, Surf. Mount Technol., No. 10, 11 (1986).

Download references

Author information

Authors and Affiliations

  1. AOZT MMP-IRBIS, Russia

    A. A. Lukin & A. N. Parfenov

  2. NPF Tekhpolikom, ul. Radio 17, Moscow, 107005, Russia

    L. I. Anikhovskaya

  3. Semenov Institute of Chemical Physics, Russian Academy of Sciences, ul. Kosygina 4, Moscow, 119991, Russia

    V. K. Skachkova

Authors
  1. A. A. Lukin
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. A. N. Parfenov
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. L. I. Anikhovskaya
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. V. K. Skachkova
    View author publications

    You can also search for this author in PubMed Google Scholar

Additional information

Original Russian Text © A.A. Lukin, A.N. Parfenov, L.I. Anikhovskaya, V. K. Skachkova, 2006, published in Klei. Germetiki, Tekhnologii, 2006, No. 3, pp. 8–11.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Lukin, A.A., Parfenov, A.N., Anikhovskaya, L.I. et al. Adhesives for assembly on printed-circuit boards. Polym. Sci. Ser. C 49, 52–55 (2007). https://doi.org/10.1134/S1811238207010122

Download citation

  • Issue Date:

  • DOI: https://doi.org/10.1134/S1811238207010122

Keywords

Search

Navigation