Abstract
Surface mount adhesives are used to hold electronic components on printed circuit boards or substrates. When dispensed onto a surface, the adhesive dots have to meet distinctive geometric requirements, such as dot diameter and height. The present paper provides an insight into how the manipulation of three key components in the formulation of a surface mount adhesive can affect the characteristics of the dispensed dot. In the search for a formulation that yields perfect dots, the rheological and time-pressure dispensing characteristics of 12 adhesive samples of different formulations based on a mixture design were investigated. All formulations were subject to viscosity and dispensing tests. From the test results, the adhesive samples were found to be shear thinning and thixotropic. The break-up length, dot diameter and volume were found to decrease with increasing viscosity, while the dot height showed otherwise. From the regression of data, most of the responses can be correlated with a linear model to the composition of the adhesive samples. Increasing component C 3 has a significant positive effect on the viscosity, break-up length, dot diameter and volume compared to component C 2, while increasing component C 1 has a negative effect on the responses. The adhesive sample, which was found to approach ‘perfection’, has the formulation of C 1 = 0.6, C 2 = 0.32, and C 3 = 0.08. This finding agrees with the optimal formulation calculated by the optimization of the responses.
Similar content being viewed by others
References
Licari JJ, Swanson DW (2011) Adhesives technology for electronic applications: materials, processing, reliability 2nd ed. Elsevier Inc, Amsterdam. doi:10.1016/B978-1-4377-7889-2.10005-1
Chen XB, Shoenau G, Zhang WJ (2000) Modeling of time-pressure fluid dispensing processes. IEEE Trans Electron Packag Manuf 23:300–305. doi:10.1109/6104.895075
Marongelli, SR (2000) Managing stringing or tailing in adhesive deposition. Retrieved from http://www3.uic.com/wcms/Images.nsf/(GraphicLib)/Adhesive+Stringing.PDF/$File/Adhesive+Stringing.PDF
Chen XB (2009) Modeling and control of fluid dispensing processes: a state-of-the-art review. Int J Adv Manuf Technol 43(3):276–286. doi:10.1007/s00170-008-1700-5
Chen XB, Zhang WJ (2003) Off-line control of time-pressure dispensing processes for electronics packaging. IEEE Trans Electron Packag Manuf 26(4):286–293. doi:10.1109/TEPM.2003.820824
Razban A (1993) Intelligent control of an automated adhesive dispensing cell PhD Thesis, Imperial College London, UK. Retrieved from EThOS: Electronic Theses Online Service. (Accession Order No. uk.bl.ethos.264877)
West AA, Williams DJ, Hinde CJ (1995) Experience of the application of intelligent control paradigms to real manufacturing processes. Proceedings of the Institution of Mechanical Engineers, Part I: Journal of Systems and Control Engineering 209(4):293–308. doi:10.1243/PIME_PROC_1995_209_396_02
Tummala RR, Rymaszewski EJ (1989) Microelectronic packaging handbook. Van Nostrand Reinhold, New York. doi:10.1007/978-1-4615-6037-1
Li J, Deng G (2004) Technology development and basic theory study of fluid dispensing—a review. High Density Microsystem Design and Packaging and Component Failure Analysis, 2004 HDP '04 Proceeding of the Sixth IEEE CPMT Conference on. pp. 198–205. doi: 10.1109/HPD.2004.1346698
Kondo M (2000) Dispensable adhesive benchmarking. Proceedings of the National Electronic Packaging Production Conference West. 2000 Anaheim, California. pp. 289–299
Marongelli SR, Dixon D, Porcari S, Cummings W, Murch F, Osterhout A. (1998) Practical production uses of SMT adhesives. Electronics Manufacturing Technology Symposium, 1998 IEMT-Europe 1998 Twenty-Second IEEE/CPMT International Berlin. pp. 147–55
Strauss R (1998) SMT Soldering Handbook 2nd ed. Newness Great Britain.doi: 10.1016/B978-075063589-9/50001-1
Chen XB, Li MG, Cao N (2009) Modeling of the fluid volume transferred in contact dispensing processes. IEEE Trans Electron Packag Manuf 32:133–137. doi:10.1109/TEPM.2009.2020515
ASTM D2196-99 (1999) Standard test methods for rheological properties of non-newtonian materials by rotational (Brookfield type) Viscometer. ASTM International, West Conshohocken, PA. doi:10.1520/D2196-99
ASTM D2556-11 (2011) Standard test method for apparent viscosity of adhesives having shear-rate-dependent flow properties. ASTM Internation, West Conshohocken, PA. doi:10.1520/D2556-11
Thibodeau L (2004) Measuring viscosity of pastes. Retrieved from http://www.brookfieldengineering.com/~staging/download/files/ar_measuringpastes.pdf
More Solutions to Sticky Problems (2014) Retrieved from http://www.brookfieldengineering.com/download/files/more_solutions.pdf
Schneider CA, Rasband WS, Eliceiri KW (2012) NIH image to ImageJ: 25 years of image analysis. Nat Methods 9:671–675. doi:10.1038/nmeth.2089
Parry MA, Billon HH, Vale MRLA (1988) Viscosity measurements of malleable explosive (MEX), a new demolition explosive. Defense Technical Information Center
Ambravaneswaran B, Basaran OA (1999) Effects of insoluble surfactants on the nonlinear deformation and breakup of stretching liquid bridges. Phys Fluids 11(5):99–1015. doi:10.1063/1.869972
Wilkes ED, Phillips SD, Basaran OA (1999) Computational and experimental analysis of dynamics of drop formation. Phys Fluids 11:3577–3598. doi:10.1063/1.870224
Lewis A, Babiarz A (1999) Conductive adhesive dispensing process considerations. Proceedings of the National Electronic Packaging Production Conference. West 1999 Anaheim, California. pp. 335–349
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Toh, B.L., Yeoh, H.K., Teoh, W.H. et al. Surface mount adhesive: in search of a perfect dot. Int J Adv Manuf Technol 90, 2083–2094 (2017). https://doi.org/10.1007/s00170-016-9549-5
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00170-016-9549-5