Skip to main content
SpringerLink
Log in

Performance of Anisotropically Conductive Adhesive Attachments on Adhesiveless Polyimide Substrate during High-Temperature Storage Tests

  • Published:
MRS Advances Aims and scope Submit manuscript

Abstract

The high-temperature performance of electronics packages was studied at 180°C, 200°C and 240°C for 3,000h. The structure tested consisted of a fairly large silicon chip attached with anisotropic conductive adhesive (ACA) onto an adhesiveless PI substrate. These structures showed good electrical reliability at 180°C. Several early failures were seen at the other temperatures. However, only 23% of the test samples failed at 200°C, while considerably more failures were seen at 240°C. The results showed that good high-temperature reliability can be achieved with polymer interconnections. However, the exposure time should be limited, especially at very high temperatures, to avoid failures caused by the materials becoming brittle.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. Committee on Material for High-Temperature Semiconductor devices; Commission on Engineering and Technical Systems; National Research Council, Materials for High-Temperature Semiconductor Devices, (The National Academic Press, Washington DC, 1995), pp. 51–63.

  2. J.B. Jullien, H. Frémont and H. Deletage, Microelectron. Reliab. 53, 1597 (2013).

    Article  CAS  Google Scholar 

  3. M.G. Pecht et al. Electronic Packaging Materials and Their Properties, (CRC Press LLC, USA, 1999) pp. 11–12.

    Google Scholar 

  4. F.A. Bechtold, (European Microelectronics and Packaging Conference Proc., Rimini, Italy, 2006) pp. 1–12.

  5. Y. Li, C.P. Wong, Mater. Sci. Eng. Rep. 51, 1 (2006)

    Article  Google Scholar 

  6. S. Lahokallio, M. Hoikkanen, J. Vuorinen and L. Frisk, Materials 8, 8641 (2015).

    Article  CAS  Google Scholar 

  7. S. Lahokallio, M. Hoikkanen, T. Marttila, J. Vuorinen, J. Kiilunen and L. Frisk, J. Electron. Mater. 45, 1184 (2016).

    Article  CAS  Google Scholar 

  8. S. Lahokallio, J. Kiilunen and L. Frisk, Microelectron. Reliab. 54, 2017 (2014).

    Article  CAS  Google Scholar 

  9. Z. Lai, J. Liu, IEEE Trans. Comp. Pack. Manuf. Tech. B. 19, 644 (1996).

    Article  CAS  Google Scholar 

  10. D. Lu, C.P. Wong, Materials for Advanced Packaging, (Springer Science + Business Media, New York, 2009) pp. 365–405.

    Book  Google Scholar 

  11. M. Ohring, Reliability and Failure of Electronic Materials and Devices, (Academic Press, USA, 1998) pp. 13–35.

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Department of Electrical Engineering, Tampere University of Technology, P.O. Box 692, 33101, Tampere, Finland

    Sanna Lahokallio & Laura Frisk

Authors
  1. Sanna Lahokallio
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Laura Frisk
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Lahokallio, S., Frisk, L. Performance of Anisotropically Conductive Adhesive Attachments on Adhesiveless Polyimide Substrate during High-Temperature Storage Tests. MRS Advances 1, 3459–3464 (2016). https://doi.org/10.1557/adv.2016.447

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1557/adv.2016.447

Search

Navigation