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Thermal Oxidation Resistance of Polyethylene Films Containing Copper and Ascorbic Acid

  • Macromolecular Compounds and Polymeric Materials
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Abstract

The thermal oxidative resistance of polyethylene films containing ascorbic acid and dispersed copper has been studied by IR spectroscopy. Experiments with the joint incorporation of ascorbic acid and dispersed copper into polyethylene have shown that a small synergistic effect of increasing the thermal oxidative resistance occurs in the resulting composite. A scheme was proposed that explains the reasons for the observed effect of increasing the thermal oxidative resistance of polyethylene. The optimal ratio of copper and ascorbic acid concentrations, leading to an effective increase in the thermal oxidative resistance of the polymer film, has been revealed. The selection of modifiers and their concentrations in the polymer was made in accordance with the main requirements for the composition of oxo-biodegradable additives for polyolefins.

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Funding

The work was carried out within the framework of the state program of scientific research of the Republic of Belarus “Physical materials science, new materials and technologies” (subprogram “Polymer materials and technologies,” problem no. 6.77; 2019–2020, subprogram “Multifunctional and composite materials,” problem no. 4.1.4 , 2021–2025).

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  1. Francisk Skorina Gomel State University, 246019, Gomel, Belarus

    E. V. Vorobyova

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  1. E. V. Vorobyova
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Correspondence to E. V. Vorobyova.

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Translated from Zhurnal Prikladnoi Khimii, No. 9, pp. 1155–1163, January, 2021 https://doi.org/10.31857/S0044461821090061

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Vorobyova, E.V. Thermal Oxidation Resistance of Polyethylene Films Containing Copper and Ascorbic Acid. Russ J Appl Chem 94, 1232–1239 (2021). https://doi.org/10.1134/S1070427221090068

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