Abstract
The crystalline structure of intermetallic Cu3Sn synthesized by successively condensing thin layers of copper and tin on a substrate at 150°C has been studied. Cu3Sn compound exists in a very narrow homogeneity range and has a long-period close-packed ordered D019 superstructure. It has been found that the crystal lattice exhibits many slip traces associated with dislocation motion. The dislocation motion is due to the stressed state of the crystal, which can be characterized as uniform extension. Electron micrographs show that slip traces in the Cu3Sn crystal are parallel to the (\(\bar {1}\bar {1}21\)) and (\(11\bar {2}1\)) planes belonging to pyramidal slip system II, which is a main slip system along with pyramidal and basal ones. Slip traces result from the motion of partial dislocations, as indicated by the amount of slip, which is equal to half the interplanar distance. Since the crystal is ordered, slip is accomplished by a pair of superpartial dislocations and a slip trace may be a superstructural or complex stacking fault.
Similar content being viewed by others
REFERENCES
D. Yao and J. K. Shang, Metall. Mater. Trans. A 26, 2677 (1995).
H. Flandorfer, U. Saeed, C. Luef, A. Sabbar, and H. Ipser, Thermochim. Acta 459, 34 (2007).
S. W. Jeong, J. H. Kim, and H. M. Lee, J. Electron. Mater. 33, 1530 (2004).
A. R. Fix, W. Nuchter, and J. Wilde, Soldering Surf. Mount Technol. 20, 13 (2008).
T. Laurila, V. Vuorinen, and J. K. Kivilahti, Mater. Sci. Eng. R 49, 1 (2005).
Y. Xia, X. Xie, and X. Xie, J. Mater. Sci. 41, 2359 (2006).
B. Liu, Y. Tian, J. Feng, and C. Wang, J. Mater. Sci. 52, 1943 (2017).
A. N. Makrushina and V. A. Plotnikov, in Proc. Int. Symp. “Advanced Materials and Technologies,” Vitebsk, Belarus, 2017, p. 134.
D. H. Nam, R. H. Kim, D. W. Han, and H. S. Kwon, Electrochim. Acta 66, 126 (2012).
M. Hansen and K. Anderko, Constitution of Binary Alloys (McGraw-Hill, 1965).
B. A. Grinberg and V. I. Syutkina, New Methods for Strengthening Ordered Alloys (Metallurgiya, Moscow, 1985).
T. Hashimoto, M. Nakamura, and S. Takeuchi, Mater. Trans. 31, 195 (1990).
J. D. Bernal, Nature 122, 54 (1928).
W.-H. Chen, C.-F. Yu, H.-C. Cheng, and S.-T. Lu, Microelectron. Reliab. 52, 1699 (2012).
Y. Watanabe, Y. Fujinaga, and H. Iwasaki, Acta Crystallogr. B 39, 306 (1983).
P. L. Brooks and E. Gillam, Acta Metall. 18, 1181 (1970).
C. J. Muller and S. Lidin, Acta Crystallogr. B 70, 879 (2014).
S. Furtauer, D. Li, D. Cupid, and H. Flandorfer, Intermetallics 34, 142 (2013).
A. A. Klopotov, A. I. Potekaev, E. V. Kozlov, Yu. I. Tyurin, K. P. Aref’ev, N. O. Solonitsina, and V. D. Klopotov, Crystallogeometrical and Crystallochemical Laws of Formation of Binary and Ternary Compounds Based on Titanium and Nickel (Tomsk. Politekh. Univ., Tomsk, 2011).
Y. Minonishi and M. H. Yoo, Philos. Mag. Lett. 61, 203 (1990).
Y. Minonishi, Philos. Mag. A 63, 1085 (1991).
Y. Umakoshi, T. Nakano, T. Takenaka, K. Sumimoto, and T. Yamane, Acta Metall. Mater. 41, 1149 (1993).
M. Legros, A. Couret, and D. Caillard, Philos. Mag. A 73, 81 (1996).
L. I. Yakovenkova, L. E. Karkina, and M. Ya. Rabovskaya, Tech. Phys. 48, 1280 (2003).
R. Oguma and S. Matsumura, Trans. Mater. Res. Soc. Jpn. 40, 325 (2015).
M. D. Starostenkov and B. F. Dem’yanov, Metallofiz. Noveishie Tekhnol. 7, 128 (1985).
S. A. Court, J. P. A. Lofvander, M. H. Loretto, and H. L. Fraser, Philos. Mag. A 59, 379 (1989).
L. I. Yakovenkova, L. E. Karkina, and M. Ya. Rabovskaya, Tech. Phys. 48, 56 (2003).
Author information
Authors and Affiliations
Corresponding author
Additional information
Translated by V. Isaakyan
Rights and permissions
About this article
Cite this article
Mokrushina, A.N., Plotnikov, V.A., Dem’yanov, B.F. et al. Substructure of Intermetallic Thin-Film Cu3Sn. Tech. Phys. 64, 853–857 (2019). https://doi.org/10.1134/S1063784219060112
Received:
Revised:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1134/S1063784219060112