Abstract
The processes of copper intercalation into the van der Waals gaps of layered ternary alloys of the family [(Ge,Sn,Pb)(Te,Se)] m [(Bi,Sb)2(Te,Se)3] n (m, n = 0, 1, 2…) to modify the electrical, mechanical, and other physical properties of samples are studied. A proportional decrease in the intercalated copper concentration ΔN Cu with decreasing relative volume density of van der Waals gaps D VdW = s –1 and with increasing package plyness s and package thickness ξ1 under variations in the composition of ternary alloys is revealed.
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Original Russian Text © M.A. Kretova, M.A. Korzhuev, E.S. Avilov, 2017, published in Fizika i Tekhnika Poluprovodnikov, 2017, Vol. 51, No. 7, pp. 937–939
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Kretova, M.A., Korzhuev, M.A. & Avilov, E.S. Electrochemical studies of copper-doping processes in layered crystals of the family [(Ge,Sn,Pb)(Te,Se)] m [(Bi,Sb)2(Te,Se)3] n (m, n = 0, 1, 2…). Semiconductors 51, 898–901 (2017). https://doi.org/10.1134/S1063782617070193
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DOI: https://doi.org/10.1134/S1063782617070193