Metal Plating on Mold Compound for EMI Shielding with Industrial Test Compliance

  • Min Fee Tai
  • Swee Leong Kok
  • Swee Kah Lee
  • Soon Lock Goh
  • Kenichiroh Mukai
  • Ken Kim
Regular Paper


The need for EMI shielding is becoming more pronounced as it is driven by miniaturization of devices, higher bandwidth of market needs, multiple applications on the same device, and heightened safety concerns with regard to the threat of electromagnetism to the health of users. In this paper, we present a reliable method for thin film coating on the surface of a molding compound by nickel and copper plating for EMI shielding applications. The correct adhesion promoter is carefully selected before proceeding into the plating process. After that, the plated samples were subjected to a series of aging processes following standard industrial compliance, and were found to have passed all the required criteria. The new approach has several advantages, such as excellent distribution of three-dimensional conformal coating and ease of mass production, which ultimately lowers the cost of production.


EMI shielding Plating Mold compound Reliability Throwing power 



The authors would like to acknowledge the support of this work by Universiti Teknikal Malaysia Melaka (UTeM) and the industrial partners, Atotech and Infineon Technologies, in sharing information, facilities, and materials.


  1. 1.
    Etnews, Korea IT news, Feb 16, 2016
  2. 2.
    F. Inoue, Conformal deposition of electroless barrier and seed layers in TSV with Au nano particle catalyst. Department of Mechanical Engineering, Kansai University, IEEE, 2010Google Scholar
  3. 3.
    T. Tanaka, Electro-less barrier/seed formation in high aspect ratio via. Tokyo Electron Kyushu Limited, Kumamoto, Japan, IEEE, 2015Google Scholar
  4. 4.
    S. Geetha, K.K. Satheesh Kumar, R.K.C. Rao, M. Vijayan, D.C. Trivedi, EMI shielding: methods and materials—a review. J. Appl. Polym. 112(4), 2073–2086 (2009)CrossRefGoogle Scholar
  5. 5.
    CovaBond MR—enabling improve adhesion of electroless Cu to smooth substrate.
  6. 6.
    R. Parkinson, Properties and applications of electroless nickel, Nickel Development Institute.
  7. 7.
    IPC-TM-650. 2.4.1. Adhesion, Tape Testing. Revision E.
  8. 8.
    IPC-TM-650 Peel Strength of Metallic Clad Laminates, Rev C, 12/94.
  9. 9.
    IPC/JEDEC J STD-020D.1 Joint Industry Standard.
  10. 10.
    JESD22-A113F. Preconditioning of nonhermetic surface mount devices prior to reliability testing. (Revision of JESD22A113E, March 2006)Google Scholar
  11. 11.
    JESD22-A102-C-Accelerated_Moisture_Resistance_-Unbiased_Autoclave. (Revision of JESD22-A102-B, December 2000)Google Scholar
  12. 12.
    JESD22-A104D Temperature cycling. (Revision of JESD22-A104C, May 2005)Google Scholar

Copyright information

© The Korean Institute of Electrical and Electronic Material Engineers 2018

Authors and Affiliations

  • Min Fee Tai
    • 1
    • 2
  • Swee Leong Kok
    • 1
  • Swee Kah Lee
    • 3
  • Soon Lock Goh
    • 3
  • Kenichiroh Mukai
    • 4
  • Ken Kim
    • 4
  1. 1.Faculty of Electronic and Computer EngineeringUniversiti Teknikal Malaysia MelakaDurian TunggalMalaysia
  2. 2.Atotech (Malaysia)Kuala LumpurMalaysia
  3. 3.Infineon TechnologyBatu BerendamMalaysia
  4. 4.Atotech USA Inc.EnglewoodUSA

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