Abstract
EMCs (Epoxy molding compounds) have been used extensively as an encapsulation and protection material for semiconductor packages. As semiconductor packages trend toward thinner, miniaturized, more function, and higher density, new requirements for EMCs are emerging. This chapter provides an overview of the most recent development on various aspects of EMC technology including advanced material development, molding process, and approaches to address different kinds of advanced packages.
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Sasajima, H. et al. (2017). New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips. In: Lu, D., Wong, C. (eds) Materials for Advanced Packaging. Springer, Cham. https://doi.org/10.1007/978-3-319-45098-8_9
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DOI: https://doi.org/10.1007/978-3-319-45098-8_9
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