Skip to main content
SpringerLink
Log in

Design and Research of Electroless Copper Plating in Microelectronics

  • Conference paper
  • First Online:
The 2020 International Conference on Machine Learning and Big Data Analytics for IoT Security and Privacy (SPIOT 2020)

Part of the book series: Advances in Intelligent Systems and Computing ((AISC,volume 1283))

  • 1501 Accesses

Abstract

The principle of electroless copper plating technology and its application status and production process in through-hole metallization, inner copper foil treatment, electronic packaging technology and electromagnetic wave shielding in printed circuit board (PCB) are briefly introduced. The development of electroless copper plating in microelectronics is prospected.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Log in via an institution
Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 169.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 219.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. Deckert, C.A.: Electroless copper plating: a reiew. Plat. Surf. Finish. 82(2), 48–55 (1995)

    Google Scholar 

  2. Dinella, D.: Printed circuit world convention VI, San Francisco, 7 (1993)

    Google Scholar 

  3. Qing, L.: Application of electroless multi-functional copper coating in electronic industry [J]. Spec. Equipment Electron. Ind. 27(2), 27–30 (1998)

    Google Scholar 

  4. Violett, J.L.N., et al.: Electromagnetic Compatibility Handbook. Van, Nostrand Reinhold Co., New York (1987)

    Book  Google Scholar 

  5. Lordi, G.A.: Electroless plating for electronic applications. Plating 54, 382 (1967)

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Department of Information Engineering, Laiwu Vocational and Technical College, No.1, Shancai Street, Laiwu, Jinan, 271100, Shandong, China

    Dong Zhenhua & Li Xiaoming

Authors
  1. Dong Zhenhua
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Li Xiaoming
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Dong Zhenhua .

Editor information

Editors and Affiliations

  1. David Goldman Informatics Centre, University of Sunderland, Sunderland, UK

    John MacIntyre

  2. University of Shanghai for Science and Technology, Shanghai, China

    Jinghua Zhao

  3. Shenzhen University, Shenzen, Guangdong, China

    Xiaomeng Ma

Rights and permissions

Reprints and permissions

Copyright information

© 2021 The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Switzerland AG

About this paper

Check for updates. Verify currency and authenticity via CrossMark

Cite this paper

Zhenhua, D., Xiaoming, L. (2021). Design and Research of Electroless Copper Plating in Microelectronics. In: MacIntyre, J., Zhao, J., Ma, X. (eds) The 2020 International Conference on Machine Learning and Big Data Analytics for IoT Security and Privacy. SPIOT 2020. Advances in Intelligent Systems and Computing, vol 1283. Springer, Cham. https://doi.org/10.1007/978-3-030-62746-1_127

Download citation

Publish with us

Policies and ethics

Search

Navigation