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Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint under Isothermal Aging

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Acta Metallurgica Sinica (English Letters) Aims and scope

Abstract

Different amounts of Fe (0.005, 0.01, 0.03, 0.05, and 0.07 wt%) were added to SAC305 to study the shear behavior damage of Fe-doped SAC solder joints under thermal loading (170 °C, holding time of 0, 250, 500, and 750 h). The results show that during isothermal aging at 170 °C, the average shear force of all solder joints decreases with increasing aging time, while the average fracture energy first increases and then decreases, reaching a maximum at 500 h. Minor Fe doping could both increase shear forces and related fracture energy, with the optimum Fe doping amount being 0.03 wt% within the entire aging range. This is because the doping Fe reduces the undercooling of the SAC305 alloy, resulting in the microstructure refining of solder joints. This in turn causes the microstructure changing from network structure (SAC305 joint: eutectic network + β-Sn) to a single matrix structure (0.03Fe-doped SAC305 joint: β-Sn matrix + small compound particles). Specifically, Fe atoms can replace some Cu in Cu6Sn5 (both inside the solder joint and at the interface), and then form (Cu,Fe)6Sn5 compounds, resulting in an increase in the elastic modulus and nanohardness of the compounds. Moreover, the growth of Cu6Sn5 and Cu3Sn intermetallic compounds (IMC) layer are inhibited by Fe doping even after the aging time prolonging, and Fe aggregates near the interface compound to form FeSn2. This study is of great significance for controlling the growth of interfacial compounds, stabilizing the microstructures, and providing strengthening strategy for solder joint alloy design.

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Data and Code Availability

The data used to support the findings of this study are available from the corresponding author upon request.

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Acknowledgements

This work was supported by the Yunnan Fundamental Research Projects (No. 202301BC070001-001) funded by the Yunnan Provincial Department of Science and Technology; the Yunnan Provincial Science and Technology Plan Project (No. 202005AF150045); the Jiangsu Province Industry-University-Research Cooperation Project (No. BY2022832) funded by the Jiangsu Provincial Department of Science and Technology; the National Natural Science Foundation of China (No. 52275339). The authors thank Professor H.L. Zhou from Jiangsu University of Science and Technology for her support and assistance in sample production and circuit board design.

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  1. Quanzhen Li and Chengming Li have contributed equally to this article.

Authors and Affiliations

  1. Jiangsu University of Science and Technology, Zhenjiang, 212003, China

    Quanzhen Li, Chengming Li, Xiaojing Wang & Shujin Chen

  2. R & D Center, Yunnan Tin Group (Holding) Co. Ltd, Kunming, 650000, China

    Shanshan Cai, Jubo Peng & Jiajun Wang

  3. The 58, Research Institute of China Electronics Technology Group Corporation, Wuxi, 214100, China

    Chengming Li

  4. Yunnan Precious Metals Lab, Sino-Platinum Metals Co., Ltd, Kunming, 650156, China

    Xiaohong Yuan

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  1. Quanzhen Li
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Contributions

Quanzheng Li involved in original draft, data curation, formal analysis, writing—original draft. Chengming Li involved in experiment, original draft, data curation. Xiaojing Wang involved in writing—review and editing, discussion, conceptualization. Shanshan Cai involved in writing—review and editing, discussion. Jubo Peng involved in supervision, writing—review. Shujin Chen involved in review and editing. Jiajun Wang involved in DSC test, Xiaohong Yuan involved in valuable discussion and analysis.

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Correspondence to Xiaojing Wang or Shanshan Cai.

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Experiments in this paper do not involve in any vivo testing on animal subjects, human subjects, or human tissue.

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Li, Q., Li, C., Wang, X. et al. Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint under Isothermal Aging. Acta Metall. Sin. (Engl. Lett.) (2024). https://doi.org/10.1007/s40195-024-01691-3

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