Abstract
The manufacturing process for flexible sensors requires a bendable substrate. Up to now, the fabrication of flexible sensor devices on flexible substrates has been highly challenging because of difficulties such as substrate alignment during deposition, patterning, and etching. We study a temporary bond–debond approach to overcome these issues. In this study, a metal foil was temporarily docked to a rigid carrier (i.e., glass sheet) for manufacturing an electronic device. We successfully implemented E-beam technology for bonding the metal foil with glass sheet. This approach allows the metal to bond with glass for relatively short time with required adhesion strength. To evaluate the applicability of this process method to electronic devices, we fabricated an optically resistive sensor based on an aluminum-doped zinc-oxide semiconductor material. After detaching the metal foil from the glass substrate, we investigated the electrical characteristics of the sensors.
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Khachatryan, H., Lee, SN., Kim, YH. et al. Temporary bonding of a thin metal foil to a glass substrate using glass powder for fabricating optical sensors. J. Korean Phys. Soc. 79, 19–24 (2021). https://doi.org/10.1007/s40042-021-00182-3
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DOI: https://doi.org/10.1007/s40042-021-00182-3