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Thermal programming of triple-shape-memory epoxy with flexible segments and Diels–Alder networks

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Abstract

This study reports the innovative preparation of triple-shape-memory epoxy resin (EP-DA) through thermal programming. Flexible poly(propylene glycol) diglycidyl ether (PEGDE) segments and reversible Diels–Alder (DA) dynamic covalent bonds were introduced into epoxy resin through molecular structural design, controlling glass transition temperature (Tg) and DA reaction temperature, respectively, which then was used as the two reversible switches of EP-DA. FTIR results verified that PEGDE and DA bond were successfully brought in EP-DA network. DSC and TG tests were used to demonstrate the three stages of EP-DA thermal behavior: Tg, DA thermal reversible reaction temperature and thermal degradation temperature. Bending-recovery test verified the dual-shape-memory, and DMA test verified the excellent triple-shape-memory of EP-DA. The general elastic deformation, high elastic deformation and flow deformation of EP-DA molecular segments revealed its shape-memory mechanism. Furthermore, when PEGDE content increased, Tg, crosslinking density of EP-DA, fixity ratio and strength decreased, toughness increased, and recovery rate as well as recovery speed were promoted. The thermal reversibility of DA bonds in EP-DA also endues it with retrievability and self-reconstruction.

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Acknowledgements

The study was financed by the Nanchang Hangkong University Research Startup Foundation (EA202101201), the work was also supported by Shenzhen Xingsen Fast Print Circuit Tech Co., Ltd.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Nanchang Hangkong University, Nanchang, 330063, China

    Liying Wan, Meiling Yan, Jianhong Wang, Xianglong Liu, Juntong Huang, Hao Yang & Xinming Kong

  2. Shenzhen Xingsen Fast Print Circuit Tech Co., Ltd, Shenzhen, China

    Xianglong Liu

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  1. Liying Wan
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  2. Meiling Yan
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Correspondence to Meiling Yan.

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Wan, L., Yan, M., Wang, J. et al. Thermal programming of triple-shape-memory epoxy with flexible segments and Diels–Alder networks. Iran Polym J 33, 93–103 (2024). https://doi.org/10.1007/s13726-023-01235-z

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  • DOI: https://doi.org/10.1007/s13726-023-01235-z

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