Abstract
SAC 305 solder bump with 800 μm diameter were produced and soldered to a custom substrate with Cu lines as leads that allow for resistance measurement during current aging. The measured joint resistance values (leads plus solder bump) before aging are 7.7 ± 1.8 mΩ and 11.8 ± 2.8 mΩ at room temperature and 160°C, respectively. In general, the resistance of the solder joint increases instantly by about 1 mΩ, when subjected to a 2.2 A aging current at 160°C. The increase is gradual in the following hours of aging and more drastic as it approaches the final failure. Four stages are identified in the resistance signal curve and compared with observations from cross sections. The stages are IMC growth, crack formation and propagation, intermittent crack healing-forming, and final failure resulting in an open connection at the cathode. Recently a periodical drop and rise behavior was reported for the resistance signal. This behavior is reproduced and attributed to the intermittent crack healing-forming stage. The healing events observed are faster than the sampling time. Possibly, as current is concentrated when bypassing interfacial cracks, local melting occurs partially filling cracks before resolidifying.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
C. M. Miller, I. E. Anderson, and J. F. Smith, J. Electron. Mater. 23, 595 (1994).
J. H. Lau, Flip Chip Technologies, Vol. 1. New York: McGraw-Hill (1996).
C.-H. Mangin and S. McClelland, Surface Mount Technol. (1987).
E. C. C. Yeh, W. J. Choi, K. N. Tu, P. Elenius, and H. Balkan, Appl. Phys. Lett. 80, 580 (2002).
T. Y. Lee, K. N. Tu, and D. R. Frear, J. Appl. Phys. 90, 4502 (2001).
L. Xu, J. H. L. Pang, and K. N. Tu, Appl. Phys. Lett. 89, 221909 (2006).
C. Y. Liu, C. Chih, C. N. Liao, and K. N. Tu, Appl. Phys. Lett. 75, 58 (1999).
T. Y. Lee, K. N. Tu, S. M. Kuo, and D. R. Frear, J. Appl. Phys. 89, 3189 (2001).
Y.-S. Lai, K.-M. Chen, C.-L. Kao, C.-W. Lee, and Y.-T. Chiu, Microelectron. Reliab. 47, 1273 (2007).
Y.-S. Lai, C.-W. Lee, and C.-L. Kao, J. Electron. Packaging. 129, 56 (2007).
Y. W. Chang, S. W. Liang, and C. Chen, Appl. Phys. Lett. 89, 032103 (2006).
C. K. Lin, Y. W. Chang, and C. Chen, J. Appl. Phys. 115, 083707 (2014).
L. Snugovsky, P. Snugovsky, D. D. Perovic, S. Bagheri, and J. W. Rutter, Mater. Sci. Tech. Ser. 25, 1467 (2009).
D.-G. Kim, J.-W. Kim, and S.-B. Jung, Thin Solid Films 504, 426 (2006).
T. Laurila, T. Mattila, V. Vuorinen, J. Karppinen, J. Li, M. Sippola, and J. K. Kivilahti, Microelectron. Reliab. 47, 1135 (2007).
D. Giancoli, “25. Electric Currents and Resistance”, “Physics for Scientists and Engineers with Modern Physics”, (4th edition ed.), p. 658, Upper Saddle River, New Jersey: Prentice Hall (1984).
R. J. Fields, S. R. Low, and G. K. Lucey, The Metal Science of Joining, pp. 165–2 (1991).
Y. W. Chang, T. H. Chiang, and C. Chen, Appl. Phys. Lett. 91, 132113 (2007).
H. W. Tseng, C. T. Lu, Y. H. Hsiao, P. L. Liao, Y. C. Chuang, T. Y. Chung, and C. Y. Liu, Microelectron. Reliab. 50, 1159 (2010).
W. J. Choi, E. C. C. Yeh, and K. N. Tu, J. Appl. Phys. 94, 5665 (2003).
Y.-H. Liu and K.-L. Lin, J. Mater. Res. 20, 2184 (2005).
K. Yamanaka, T. Yutaka, and K. Suganuma, Microelectron. Reliab. 47, 1280 (2007).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Xu, D.E., Chow, J., Mayer, M. et al. Sn-Ag-Cu to Cu joint current aging test and evolution of resistance and microstructure. Electron. Mater. Lett. 11, 1078–1084 (2015). https://doi.org/10.1007/s13391-015-5201-z
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s13391-015-5201-z