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Design for reliability of ferrite for electronics materials

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Abstract

An accelerated life test for miniaturized ferrite cores used in SMD type inductors is proposed. Conventionally, temperature cycling test is performed to check whether cracks are initiated and propagated or not. Since the test requires a long time, an equivalent fatigue test is devised: thermal stress analysis is performed to identify stress distribution. Fracture strength is obtained by tensile tests and simulation analysis shows that the stress distributions are almost identical for the cases of the temperature cycle test and fatigue test. From the life-stress relationship and lifetime distribution, the acceleration factor is estimated and a method to evaluate the life of ferrite is suggested.

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Authors and Affiliations

  1. Center of Energy Material, Green Ceramic Div., Korea Institute of Ceramic Engineering & Technology (KICET), Seoul, 153-801, Korea

    Hyoung-Seuk Choi

  2. Department of Ceramic Engineering, Hanyang University, Seoul, 133-791, Korea

    Hyoung-Seuk Choi

  3. Quality Management Team, Samsung Electro-mechanics Co. Ltd., Suwon Suwon-si, Gyeonggi, 443-743, Korea

    Kang-Dong Kim

  4. Division of Industrial & Information Systems Engineering, Ajou University, Suwon-si, Gyeonggi, 443-749, Korea

    Kang-Dong Kim & Joong Soon Jang

Authors
  1. Hyoung-Seuk Choi
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  2. Kang-Dong Kim
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  3. Joong Soon Jang
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Correspondence to Kang-Dong Kim.

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Choi, HS., Kim, KD. & Jang, J.S. Design for reliability of ferrite for electronics materials. Electron. Mater. Lett. 7, 63–70 (2011). https://doi.org/10.1007/s13391-011-0310-9

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  • DOI: https://doi.org/10.1007/s13391-011-0310-9

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