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Quality and functionality of Chinese steamed bread and dough added with selected non-starch polysaccharides

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Abstract

This study was devised to obtain a better insight into the effect of selected non-starch polysaccharides (NSP), namely carboxymethylcellulose (CMC), locust bean gum (LBG) and psyllium husk powder (PSY) on wheat dough rheological behaviour and quality attributes of Chinese steamed bread (CSB). NSP was added at levels of 0.2 % and 0.8 % w/w (wheat flour basis). Mixing properties and extensional properties of the dough produced were assessed by farinograph and extensograph, respectively. Spread ratio, specific volume and firmness of CSB were determined as a function of storage time. Addition of 0.2 % w/w NSP was found to decrease water absorption and strengthen the dough, and also to increase dough development time and dough stability. A reverse trend was observed at 0.8 % level. Among all the samples studied, addition of PSY at 0.2 % was found to confer an appropriate level of dough strength and extensibility that caused desirable spread ratio as well as specific volume in CSB. The results also revealed that NSP at high addition level helps to soften CSB and prevent staling from occurring, and hence warrant a longer shelf-life.

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Abbreviations

A:

Work applied to stretch dough

BU:

Brabender Unit

CMC:

Carboxymethylcellulose

CSB:

Chinese steamed bread

FU:

Farinograph Unit

LBG:

Locust bean gum

NSP:

Non-starch polysaccharide

PSY:

Psyllium husk powder

Rmax/E:

Ratio of maximum resistance to extensibility

Rmax :

Maximum resistance

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Acknowledgements

This work was financially supported by Kuok Foundation and Malayan Sugar Manufacturing Co. Bhd through a research grant (304/PTEKIND/650441/K132). S.Y. Sim wishes to thank Institute of Postgraduate Studies, Universiti Sains Malaysia for fellowship support.

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Correspondence to L. H. Cheng.

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Sim, S.Y., Noor Aziah, A.A. & Cheng, L.H. Quality and functionality of Chinese steamed bread and dough added with selected non-starch polysaccharides. J Food Sci Technol 52, 303–310 (2015). https://doi.org/10.1007/s13197-013-0967-1

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