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Performance Assessments of Gate Engineered Dopingless Schottky Tunnel MOSFET in Presence of Interfacial Trap Charges

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Abstract

The most notable accumulation of trap charges occurs on the oxide/semiconductor interface of MOS devices and it degrades the device’s performance and reliability. In this literature, we proposed a gate-engineered Schottky tunneling MOSFET(GE-ST-MOSFET) for ON state performance improvement, and a detailed analysis of the effects of interface trap charges (ITCs) on the DC characteristics and analog/RF performance metrics have been analyzed. In this device, the electrostatically doping-based dopant segregation layer (DSL) is introduced at the source side in the channel end by the Tunneling Gate(TG). A comparative study between the proposed GE-ST-MOSFET and conventional Schottky tunneling MOSFET(ST-MOSFET) has been carried out in presence of interface trap charges at the \(\textrm{HfO}_{2}\)/Si interface. A significant improvement in \(\textrm{I}_{\textrm{ON}}\) and \(\textrm{I}_{\textrm{ON}}/\textrm{I}_{\textrm{OFF}}\) ratio has been achieved 563 \(\times \) and 1472\(\times \) respectively in the GE-ST-MOSFET as compared to the ST-MOSFET. To analyze the linearity behavior, higher-order transconductance parameters are also studied considering the effect of ITCs. Furthermore, the circuit-level performances of both devices are analyzed using the Verilog-A based models. The effect of OFF current variation on switching performance has been investigated. It has been found that the average switching delay and Power Delay Product (PDP) have improved by 97% and 81% respectively in comparison to the conventional device-based inverter. The GE-ST-MOSFET-based circuit also shows better immunity to interface trap charges. In addition, the implementation of the electrostatically doping concept for the proposed device could make fabrication very simple.

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References

  1. Gopalakrishnan K, Griffin PB, Plummer JD (2002) I-mos: A novel semiconductor device with a subthreshold slope lower than kt/q. Digest. International Electron Devices Meeting, IEEE, pp 289–292

    Google Scholar 

  2. Chau R, Datta S, Doczy M, Doyle B, Jin B, Kavalieros J, Majumdar A, Metz M, Radosavljevic M (2005) Benchmarking nanotechnology for high-performance and low-power logic transistor applications. IEEE Trans Nanotechnol 4(2):153–158

    Article  Google Scholar 

  3. Boucart K, Ionescu AM (2007) Double-gate tunnel fet with high-\(\kappa \) gate dielectric. IEEE Trans Electron Devices 54(7):1725–1733

    Article  CAS  Google Scholar 

  4. Doria RT, Pavanello MA, Trevisoli RD, de Souza M, Lee CW, Ferain I, Akhavan ND, Yan R, Razavi P, Yu R et al (2011) Junctionless multiple-gate transistors for analog applications. IEEE Trans Electron Devices 58(8):2511–2519

    Article  CAS  Google Scholar 

  5. Dennard RH, Gaensslen FH, Yu HN, Rideout VL, Bassous E, LeBlanc AR (1974) Design of ion-implanted MOSFET’s with very small physical dimensions. IEEE J Solid-State Circ 9(5):256–268

    Article  Google Scholar 

  6. Skotnicki T, Hutchby JA, King TJ, Wong HS, Boeuf F (2005) The end of CMOS scaling: toward the introduction of new materials and structural changes to improve MOSFET performance. IEEE Circ Devices Mag 21(1):16–26

    Article  Google Scholar 

  7. Loan SA, Qureshi S, Iyer SSK (2010) A novel partial-ground-plane-based MOSFET on selective buried oxide: 2-d simulation study. IEEE Trans Electron Devices 57(3):671–680

    Article  Google Scholar 

  8. Khakifirooz A, Cheng K, Jagannathan B, Kulkarni P, Sleight JW, Shahrjerdi D, Chang JB, Lee S, Li J, Bu H et al (2010) Fully depleted extremely thin soi for mainstream 20nm low-power technology and beyond. In: 2010 IEEE International Solid-State Circuits Conference-(ISSCC), IEEE, pp 152–153

  9. Verma S, Loan SA, Alamoud AM, Alharbi AG (2018) Hybrid algan/gan high-electron mobility transistor: design and simulation. IET Circ Devices Syst 12(1):33–39

    Article  Google Scholar 

  10. Larson JM, Snyder JP (2006) Overview and status of metal s/d Schottky-barrier MOSFET technology. IEEE Trans Electron Devices 53(5):1048–1058

    Article  CAS  Google Scholar 

  11. Larrieu G, Yarekha DA, Dubois E, Breil N, Faynot O (2009) Arsenic-segregated rare-earth silicide junctions: reduction of Schottky barrier and integration in metallic n-MOSFETs on SOI. IEEE Electron Device Lett 30(12):1266–1268

    Article  CAS  Google Scholar 

  12. Östling M, Luo J, Gudmundsson V, Hellström PE, Malm BG (2010) Nanoscaling of mosfets and the implementation of schottky barrier s/d contacts. In: 2010 27th International Conference on Microelectronics Proceedings, IEEE, pp 9–13

  13. Bashir F, Loan SA, Rafat M, Alamoud ARM, Abbasi SA (2015) A high-performance source engineered charge plasma-based Schottky MOSFET on SOI. IEEE Trans Electron Devices 62(10):3357–3364

  14. Lee SK, Zetterling CM, Östling M (2001) Schottky barrier height dependence on the metal work function for p-type 4h-silicon carbide. J Electron Mater 30(3):242–246

    Article  CAS  Google Scholar 

  15. Vega RA (2006) Comparison study of tunneling models for Schottky field effect transistors and the effect of Schottky barrier lowering. IEEE Trans Electron Devices 53(7):1593–1600

    Article  CAS  Google Scholar 

  16. Zhang M, Knoch J, Appenzeller J, Mantl S (2007) Improved carrier injection in ultrathin-body SOI Schottky-barrier MOSFETs. IEEE Electron Device Lett 28(3):223–225

    Article  Google Scholar 

  17. Jhaveri R, Nagavarapu V, Woo JC (2008) Asymmetric Schottky tunneling source SOI MOSFET design for mixed-mode applications. IEEE Trans Electron Devices 56(1):93–99

    Article  Google Scholar 

  18. Loan SA, Kumar S, Alamoud AM (2016) A novel double gate metal source/drain Schottky MOSFET as an inverter. Superlattice Microst 91:78–89

    Article  CAS  Google Scholar 

  19. Larrieu G, Dubois E (2004) Schottky-barrier source/drain MOSFETs on ultrathin SOI body with a tungsten metallic midgap gate. IEEE Electron Device Lett 25(12):801–803

  20. Vega RA, Liu TJK (2010) Dopant-segregated Schottky junction tuning with fluorine pre-silicidation ion implant. IEEE Trans Electron Devices 57(5):1084–1092

    Article  Google Scholar 

  21. Patil GC, Qureshi S (2011) A novel \(\delta \)-doped partially insulated dopant-segregated schottky barrier soi mosfet for analog/rf applications. Semicond Sci Technol 26(8):085002

    Article  Google Scholar 

  22. Larrieu G, Dubois E (2011) CMOS inverter based on Schottky source-drain mos technology with low-temperature dopant segregation. IEEE Electron Device Lett 32(6):728–730

    Article  CAS  Google Scholar 

  23. Bashir F, Alharbi AG, Loan SA (2017) Electrostatically doped DSL Schottky barrier MOSFET on SOI for low power applications. IEEE J Electron Devices Soc 6:19–25

    Article  CAS  Google Scholar 

  24. Kumar P, Bhowmick B (2018) Suppression of ambipolar conduction and investigation of rf performance characteristics of gate-drain underlap sige schottky barrier field effect transistor. Micro Nano Lett 13(5):626–630

    Article  CAS  Google Scholar 

  25. Kale S (2020) Investigation of dual metal gate schottky barrier mosfet for suppression of ambipolar current. IETE J Res 69(1):1–6

  26. Kumar P, Bhowmick B (2020) Source-drain junction engineering Schottky barrier MOSFETs and their mixed mode application. Silicon 12(4):821–830

    Article  CAS  Google Scholar 

  27. Rashid S, Bashir F, Khanday FA, Beigh MR, Hussin FA (2021) 2-d design of double gate Schottky tunnel MOSFET for high-performance use in analog/rf applications. IEEE Access 9:80158–80169

  28. Srivastava A, Fahad MS, Sharma AK, Mayberry C (2019) Computational study of silicene nanoribbon tunnel field-effect transistor. Microsyst Technol 28(1):1–6

  29. Venkatesh P, Nigam K, Pandey S, Sharma D, Kondekar PN (2017) Impact of interface trap charges on performance of electrically doped tunnel fet with heterogeneous gate dielectric. IEEE Trans Device Mater Reliab 17(1):245–252

    Article  CAS  Google Scholar 

  30. Pala M, Esseni D, Conzatti F (2012) Impact of interface traps on the iv curves of inas tunnel-fets and mosfets: A full quantum study. In: 2012 international Electron devices meeting, IEEE, p 6

  31. Wang R, Jiang X, Yu T, Fan J, Chen J, Pan DZ, Huang R (2013) Investigations on line-edge roughness (ler) and line-width roughness (lwr) in nanoscale CMOS technology: Part ii-experimental results and impacts on device variability. IEEE Trans Electron Devices 60(11):3676–3682

    Article  Google Scholar 

  32. Garg N, Pratap Y, Gupta M, Kabra S (2020) Reliability assessment of gaas/alo junctionless finfet in the presence of interfacial layer defects and radiations. IEEE Trans Device Mater Reliab 20(2):452–458

  33. Tripathy MR, Samad A, Singh AK, Singh PK, Baral K, Mishra AK, Jit S (2021) Impact of interface trap charges on electrical performance characteristics of a source pocket engineered ge/si heterojunction vertical tfet with hfo2/al2o3 laterally stacked gate oxide. Microelectron Reliab 119(114):073

  34. Kumar M, Haldar S, Gupta M, Gupta R (2016) Analytical model of threshold voltage degradation due to localized charges in gate material engineered schottky barrier cylindrical gaa mosfets. Semicond Sci Technol 31(10):105013

    Article  Google Scholar 

  35. Rashid S, Bashir F, Khanday FA, Beigh MR (2023) L-shaped Schottky barrier MOSFET for high performance analog and rf applications. Silicon 15(1):205–215

    Article  CAS  Google Scholar 

  36. Manual AU (2008) Device simulation software. Silvaco Int, Santa Clara, CA

    Google Scholar 

  37. Matsuzawa K, Uchida K, Nishiyama A (1999) Monte carlo simulation of 50 nm devices with schottky contact model. In: 1999 International Conference on Simulation of Semiconductor Processes and Devices. SISPAD’99 (IEEE Cat. No. 99TH8387), IEEE, pp 35–38

  38. Çankaya G, Ucar N (2004) Schottky barrier height dependence on the metal work function for p-type si Schottky diodes. Z Naturforsch A 59(11):795–798

    Article  Google Scholar 

  39. Chiang TK (2011) A compact model for threshold voltage of surrounding-gate MOSFETs with localized interface trapped charges. IEEE Trans Electron Devices 58(2):567–571

    Article  Google Scholar 

  40. Shabde S, Bhattacharyya A, Kao RS, Muller RS (1988) Analysis of MOSFET degradation due to hot-electron stress in terms of interface-state and fixed-charge generation. Solid State Electron 31(11):1603–1610

    Article  Google Scholar 

  41. Zhang XY, Hsu CH, Lien SY, Chen SY, Huang W, Yang CH, Kung CY, Zhu WZ, Xiong FB, Meng XG (2017) Surface passivation of silicon using hfo2 thin films deposited by remote plasma atomic layer deposition system. Nanoscale Res Lett 12(1):1–7

    Google Scholar 

  42. Alfaraj N, Rasheedi N (2017) Fabrication simulation of a flexible metal oxide semiconductor field-effect transistor

  43. Frangis N, Van Landuyt J, Kaltsas G, Travlos A, Nassiopoulos A (1997) Growth of erbium-silicide films on (100) silicon as characterised by electron microscopy and diffraction. J Cryst Growth 172(1–2):175–182

  44. Madan J, Chaujar R (2016) Interfacial charge analysis of heterogeneous gate dielectric-gate all around-tunnel fet for improved device reliability. IEEE Trans Device Mater Reliab 16(2):227–234

  45. Kale S, Kondekar PN (2017) Design and investigation of dielectric engineered dopant segregated Schottky barrier MOSFET with nisi source/drain. IEEE Trans Electron Devices 64(11):4400–4407

    Article  CAS  Google Scholar 

  46. Strangio S, Settino F, Palestri P, Lanuzza M, Crupi F, Esseni D, Selmi L (2018) Digital and analog tfet circuits: Design and benchmark. Solid State Electron 146:50–65

    Article  CAS  Google Scholar 

  47. Bashir M, Raushan M, Ahmad S, Siddiqui MJ et al (2021) Investigation of gate material engineering in junctionless transistor for digital and analog applications. Silicon 14(6):1–12

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Acknowledgements

The authors acknowledge Dr. Kunal Singh, Assistant Professor of NIT Jamshedpur for providing the Silvaco TCAD tool. The authors also acknowledge the SMDP-C2SD Project under the Government of India for providing the Cadence Virtuoso Tool.

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Author 1 (Arnab Som) Prepared the outline, conducted the simulation and analyzed the whole work, and prepared the manuscript. Author 2 (Sanjay Kumar Jana) Supervised the whole work and thoroughly revised the manuscript. The author(s) read and approved the final manuscript.

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Correspondence to Arnab Som.

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Som, A., Jana, S.K. Performance Assessments of Gate Engineered Dopingless Schottky Tunnel MOSFET in Presence of Interfacial Trap Charges. Silicon 15, 7265–7278 (2023). https://doi.org/10.1007/s12633-023-02504-5

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