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Effect of Process-Induced Variations on Analog Performance of Silicon based Nanosheet Transistor

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Abstract

The reliability of Silicon-based nanosheet transistors (NSTs) is limited by process-induced variations (PIVs) like work-function-variations (WFV), line-edge-roughness (LER), gate-edge-roughness (GER), sheet-thickness-variation (STV), etc. This study reports the overall effect of PIVs on the analog performance of 5-nm node n-channel NST, with gate length and width of 12 nm and 15 nm, respectively, using a fully calibrated TCAD platform. NST’s transconductance (gm) and output conductance (gds) are strongly affected by PIVs, leading to as much as ~ 23% change in intrinsic gain (Av) and gain-frequency-product (GFP) values. Variations in discharge-time (td) values of NST indicate that the average drive current can vary between ~ -17.4% and ~ 24.4% of the typical value. Also, the PIVs cause NST’s unit-gain-frequency (fT) to vary by ~ 1.4%.

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References

  1. Bohr MT, Young IA (2017) CMOS scaling trends and beyond. IEEE Micro 37:20–29. https://doi.org/10.1109/MM.2017.4241347

    Article  Google Scholar 

  2. Salahuddin S, Ni K, Datta S (2018) The era of hyper-scaling in electronics. Nat Electron 1:442–450. https://doi.org/10.1038/s41928-018-0117-x

    Article  Google Scholar 

  3. Xie R, Montanini P, Akarvardar K, et al A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels. In: 2016 IEEE Electron Device Meeting (IEDM). pp 2.7.1–2.7.4

  4. Ha D, Yang C, Lee J, et al (2017) Highly manufacturable 7nm FinFET technology featuring EUV lithography for low power and high performance applications. Digest of Technical Papers - Symposium on VLSI Technology T68–T69. https://doi.org/10.23919/VLSIT.2017.7998202

  5. Auth C, Aliyarukunju A, Asoro M, et al (2018) A 10nm high performance and low-power CMOS technology featuring 3rd generation FinFET transistors, self-aligned quad patterning, contact over active gate and cobalt local interconnects. Technical Digest - International Electron Devices Meeting, IEDM 29.1.1–29.1.4. https://doi.org/10.1109/IEDM.2017.8268472

  6. Radamson HH, Zhang Y, He X, et al (2017) The challenges of advanced CMOS process from 2D to 3D. Applied Sciences (Switzerland) 7:. https://doi.org/10.3390/app7101047

  7. Loubet N, Hook T, Montanini P, et al (2017) Stacked nanosheet gate-all-around transistor to enable scaling beyond FinFET. Digest of technical papers - symposium on VLSI technology T230--T231. https://doi.org/10.23919/VLSIT.2017.7998183

  8. Veloso A, Eneman G, de Keersgieter A et al (2021) Nanosheet FETs and their potential for enabling continued moore’s law scaling. 2021 5th IEEE Electron Devices Technology and Manufacturing Conference. EDTM 2021:2–4. https://doi.org/10.1109/EDTM50988.2021.9420942

    Article  Google Scholar 

  9. Yoon JS, Lee S, Lee J et al (2020) Reduction of process variations for sub-5-nm node fin and nanosheet FETs using novel process scheme. IEEE Trans Electron Devices 67:2732–2737. https://doi.org/10.1109/TED.2020.2995340

    Article  CAS  Google Scholar 

  10. Rawat A, Harsha Vardhan P, Ganguly U (2020) Nanoscale transistor variability modeling: how simple physics enables a powerful prediction platform. IEEE Nanotechnol Mag 14:4–16

    Article  Google Scholar 

  11. Jha CK, Yogi P, Gupta C et al (2020) Comparison of LER induced mismatch in NWFET and NSFET for 5-nm CMOS. IEEE Journal of the Electron Devices Society 8:1184–1192

    Article  CAS  Google Scholar 

  12. Tassis DH, Fasarakis N, Dimitriadis CA, Ghibaudo G (2013) Variability analysis - Prediction method for nanoscale triple gate FinFETs. 2013 IEEE International Semiconductor Conference Dresden - Grenoble: Technology, Design, Packaging, Simulation and Test, ISCDG 2013. https://doi.org/10.1109/ISCDG.2013.6656325

  13. Zimpeck A, Meinhardt C, Artola L, Reis R (2021) Mitigating process variability and soft errors at circuit-level for FinFETs

  14. Huff M (2021) Review—important considerations regarding device parameter process variations in semiconductor-based manufacturing. ECS Journal of Solid State Science and Technology 10:064002

    Article  Google Scholar 

  15. Li Y, Hwang CH, Li TY, Han MH (2010) Process-variation effect, metal-gate work-function fluctuation, and random-dopant fluctuation in emerging CMOS technologies. IEEE Trans Electron Devices 57:437–447. https://doi.org/10.1109/TED.2009.2036309

    Article  CAS  Google Scholar 

  16. Harsha Vardhan P, Amita GS, Ganguly U (2019) Threshold voltage variability in nanosheet GAA transistors. IEEE Trans Electron Devices 66:4433–4438. https://doi.org/10.1109/TED.2019.2933061

    Article  Google Scholar 

  17. Zhang Z, Jiang X, Wang R et al (2018) Extraction of process variation parameters in FinFET technology based on compact modeling and characterization. IEEE Trans Electron Devices 65:847–854. https://doi.org/10.1109/TED.2018.2790083

    Article  CAS  Google Scholar 

  18. Pundir YP, Bisht A, Saha R, et al (2022) Power supply variations and analog performance of 5-nm node silicon Nanosheet transistor. In: 2022 International Conference on Advances in Computing, Communication and Materials, ICACCM 2022. Institute of Electrical and Electronics Engineers Inc.

  19. Pundir YP, Bisht A, Saha R, et al (2022) Effect of temperature on performance of 5-nm node Nanosheet Transistors for Analog Applications. https://doi.org/10.1007/s12633-022-01800-w

  20. Saha R, Bhowmick B, Baishya S (2018) Temperature effect on RF/analog and linearity parameters in DMG FinFET. Appl Phys A Mater Sci Process 124:0. https://doi.org/10.1007/s00339-018-2068-5

  21. Park HH, Choi W, Pourghaderi MA, et al (2019) Negf simulations of stacked silicon nanosheet fets for performance optimization. In: International Conference on Simulation of Semiconductor Processes and Devices, SISPAD. pp 9–11

  22. Kim S, Kim M, Ryu D et al (2020) Investigation of electrical characteristic behavior induced by channel-release process in stacked nanosheet gate-all-around MOSFETs. IEEE Trans Electron Devices 67:1–5. https://doi.org/10.1109/ted.2020.2989416

    Article  CAS  Google Scholar 

  23. Jeong J, Yoon JS, Lee S, Baek RH (2020) Comprehensive analysis of source and drain recess depth variations on silicon nanosheet FETs for Sub 5-nm node SoC application. IEEE Access 8:35873–35881. https://doi.org/10.1109/ACCESS.2020.2975017

    Article  Google Scholar 

  24. Mohapatra E, Dash TP, Jena J, et al (2020) Strain induced variability study in gate-all-around vertically-stacked horizontal Nanosheet Transistors. Phys Scr 95:. https://doi.org/10.1088/1402-4896/ab89f5

  25. Yoon JS, Jeong J, Lee S, Baek RH (2020) Sensitivity of source/drain critical dimension variations for sub-5-nm node Fin and nanosheet FETs. IEEE Trans Electron Devices 67:258–262. https://doi.org/10.1109/TED.2019.2951671

    Article  CAS  Google Scholar 

  26. Synopsys (2019) Sentaurus device user guide, version Q-2019.12

  27. Yoon JS, Jeong J, Lee S, Baek RH (2018) Multi-Vth strategies of 7-nm node nanosheet FETs with limited nanosheet spacing. IEEE J Electron Dev Soc 6:861–865. https://doi.org/10.1109/JEDS.2018.2859799

    Article  CAS  Google Scholar 

  28. Pundir YP, Bisht A, Saha R, Pal PK (2021) Air-spacers as analog-performance booster for 5 nm-node N-channel nanosheet transistor. Semicond Sci Technol. https://doi.org/10.1088/1361-6641/ac16e6

    Article  Google Scholar 

  29. Pundir YP, Saha R, Pal PK (2020) Effect of gate length on performance of 5nm node N-channel nano-sheet transistors for analog circuits. Semicond Sci Technol 36:. https://doi.org/10.1088/1361-6641/abc51e

  30. Yoon J-S, Jeong J, Lee S, Baek R-H (2018) Systematic DC/AC performance benchmarking of Sub-7-nm node FinFETs and nanosheet FETs. IEEE Journal of the Electron Devices Society 6:942–947. https://doi.org/10.1109/JEDS.2018.2866026

    Article  CAS  Google Scholar 

  31. Sun Y, Gao H, Li X, Member GS (2021) Impact of process fluctuations on RF small-signal parameter of gate-all-around nanosheet transistor beyond 3 nm node. 1–8

  32. Chen C-Y, Lin JT, Chiang M-H (2016) Fabrication variability in multiple gate MOSFETs: a bulk FinFET study. ECS J Solid State Sci Technol 5:P3096–P3100. https://doi.org/10.1149/2.0181604jss

    Article  CAS  Google Scholar 

  33. Song SC, Colombeau B, Bauer M, et al (2019) 2nm Node: Benchmarking FinFET vs nano-slab transistor architectures for artificial intelligence and next gen smart mobile devices. Digest of Technical Papers - Symposium on VLSI Technology 2019-June:T206–T207. https://doi.org/10.23919/VLSIT.2019.8776478

  34. Loke ALS, Wu Z, Moallemi R, et al (2010) Constant-current threshold voltage extraction in HSPICE for nanoscale CMOS analog design. Synopsys Users Group (SNUG) 1–19

  35. Tayal S, Ajayan J, Joseph LMIL, et al (2021) A Comprehensive Investigation of Vertically Stacked Silicon Nanosheet Field Effect Transistors: an Analog/RF Perspective. Silicon. https://doi.org/10.1007/s12633-021-01128-x

  36. Verma YK, Mishra V, Gupta SK (2020) Analog/RF and linearity distortion analysis ofMgZnO/CdZnO quadruple-gate field effect transistor (QG-FET). Silicon. https://doi.org/10.1007/s12633-020-00406-4

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Yogendra Pratap Pundir has contributed to the Conceptualization, Methodology, Writing of Original Draft, Software, Data Curation, Investigation, and Editing. Arvind Bisht and Rajesh Saha have contributed to the Formal analysis. Pankaj Kumar Pal has contributed to the Formal analysis and Editing of this paper. All authors have contributed to the review and revision of this paper.

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Correspondence to Yogendra Pratap Pundir.

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Pundir, Y.P., Bisht, A., Saha, R. et al. Effect of Process-Induced Variations on Analog Performance of Silicon based Nanosheet Transistor. Silicon 15, 4449–4455 (2023). https://doi.org/10.1007/s12633-023-02365-y

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