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Hot deformation characterization and processing map of Cu–10 %Fe–1.5 %Ag in situ composite

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Abstract

The Cu–10 %Fe–1.5 %Ag in situ composite with high strength, high conductivity and low cost was prepared, and its hot deformation behavior was investigated by isothermal compression test with true strain of 0.69, temperature range of 750–950 °C and strain rate of 0.002–1.000 s−1. The flow stress–strain response shows the characterization of dynamic recrystallization (DRX), and the peak stress increases gradually with deformation temperature decreasing and strain rate increasing. The deformation activation energy of the composite for DRX is calculated as 241.864 kJ·mol−1. The constitutive relation of the composite was got by Arrhenius equation. Furthermore, according to the dynamic material modeling and Kumar–Prasad’s instability criteria, the processing map was constructed and the unsafe regions for hot deformation were analyzed. Based on the processing map and microstructural evolution, the optimal parameter range for hot deformation processing is 750–863 °C at the strain rate of 0.002–0.013 s−1.

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Acknowledgments

This project was financially supported by the National Natural Science Foundation of China (No. 50571035) and the National High-Tech Research and Development Project (No. 2006AA03Z528).

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Authors and Affiliations

  1. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an, 710072, China

    Jun-Qing Guo & He Yang

  2. School of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai, 200093, China

    Ping Liu

  3. School of Materials Science and Engineering, University of Henan Science and Technology, Luoyang, 471023, China

    Zhi-Wei Cai

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  1. Jun-Qing Guo
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  2. He Yang
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  3. Ping Liu
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  4. Zhi-Wei Cai
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Correspondence to He Yang.

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Guo, JQ., Yang, H., Liu, P. et al. Hot deformation characterization and processing map of Cu–10 %Fe–1.5 %Ag in situ composite. Rare Met. 36, 912–918 (2017). https://doi.org/10.1007/s12598-016-0733-4

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  • DOI: https://doi.org/10.1007/s12598-016-0733-4

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