Preparation and properties of partially dry-processed poly (m-phenylene isophthalamide) films

Abstract

Poly (m-phenylene isophthalamide) (PMIA), one of the most important aromatic polyamides, has been widely used due to its high thermal resistivity combined with its excellent mechanical properties. PMIA also has superior electrical properties. Meta-linked aromatic polyamide was synthesized by solution polymerization of m-phenylene diamine with isophthaloyl chloride in a polar organic solvent, such as dimethylacetamide (DMAc). When forming PMIA films, properties of films can differ according to DMAc contents in polymers. Thus, DMAc as a PMIA solvent was evaporated using a drying process at 80 °C for two hours. By contrast, we included other control groups. In one group, dried film was stretched to its maximum length. And, in another group, film was stretched and heat treated at 200 °C for 10 min. Therefore, using this method, these films were prepared at each concentration. For analysis of their properties, PMIA films were prepared in the same way; properties of PMIA films were investigated through analysis of Instron, XRD, FT-IR, SEM, and TGA. Results of these analyses will provide information on optimized mechanical and thermal conditions for use of poly (m-phenylene isophthalamide) film derived from m-phenylene diamine and isophthaloyl chloride using dimethylacetamide (DMAc) as a solvent.