Abstract
A close-looped process based on the membrane separation and electrolysis is proposed to regenerate the copper etchant in-situ, recover copper on-site and reuse it. It is characterized by selective separation of copper from the spent etchant, which is accomplished by the ion exchange membrane-electrowinning, and at the same time the other components useful for etching are reclaimed. The experiments show that at least 90% of electricity efficiency for copper removal can be maintained and the optimum condition for membrane-electrowinning is: cell voltage 2–2.5 V, operating temperature 40–50 °C and current density 500–1500 A/m2. The regenerated etchant can be successfully reused to etch copper after adjusting its composition to the normal range, and its recycling property is as good as that of the fresh etchant after 50 times of use-disposal-regeneration cycles.
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References
Ballantine A W. Etch process and apparatus therefore [P]. US 20040144750, 2004.
Lillie D. Etching solution for forming an embedded resistor[P]. US 20030150840, 2003.
Aegerter B. Selective treatment of the surface of a microelectronic workpiece[P]. US 20050020001, 2005.
Richard H W. Additives for copper etchants[P]. CN94193307, 1994.
David M A. Increasing utilization efficiency of ferric chloride etchant in industrial photochemical machine [J]. J Environ Monit, 1998(1): 103–108.
Culpovich P. Automatic etchant regeneration system with highly accurate sensor for monitoring etchant composition[P]. US 6551521, 2003.
Barrett D G. Cupric chloride regeneration[J]. Journal PCMI, 1991, 4: 15–17.
David M A. The potential of oxygen for regeneration of spent ferric chloride etchant solutions[J]. The Journal (PCMI), 1995, 6: 3–6.
LI De-liang. Recycling methods and related apparatus for copper etchants[P]. CN0315367, 2003.
LI De-liang, WU Xiao-hu. Selective removal of nickel from iron substrate by non-cyanide strippers [J]. Trans Nonferrous Met Soc China, 2004, 14(3): 599–603.
LI De-liang, WANG Dian-zhuo. Selective leaching Ni (II) from AMD sludge by using ethylenediamine-ammonium sulfate[J]. Trans Nonferrous Met Soc China, 2002, 12(6): 1176–1179.
TANG Dian. Electroless copper plating on difficultly deposited substrates by using glyoxylic acid as reducing agent[J]. The Chinese Journal of Nonferrous Metals, 2003, 13(5): 1252–1256. (in Chinese)
LIU Xiao-rong. Effect of Lix984N content on phase disengagement dynamics in copper-SX[J]. Trans Nonferrous Met Soc China, 2003, 13(4): 963–967.
LI Shi-xiong. Industrial control of copper electrolysis additive[J]. The Chinese Journal of Nonferrous Metals, 2004, 14(1): 132–137. (in Chinese)
CHEN Bu-shen. Non-toxic process for copper recovery(II)—copper separation by N(530) extractant and its electrowinning[J]. Nonferrous Metals, 1998(3): 403–407. (in Chinese)
Glazunova Z S, et al. Electrolytic process of regeneration of pickling solutions[P]. RU2180693, 2002.
SHI Jun. Handbook on Membrane Technology[M]. Beijing: Chemical Industry Press, 2001. 425–480.
WEI Qi-feng, ZHANG Qi-xiu. Preparation of copper powder by cation-exchange membrane coupling electrolysis[J]. J Cent South Uni, 2004, 35(supple 1): 154–158. (in Chinese)
WEI Qi-feng, ZHANG Qi-xiu. Preparation of copper powder by anion-exchange membrane electrolysis[J]. Nonferrous Metallurgy, 2003, 32(3): 10–14. (in Chinese)
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Foundation item: Project supported by the Innovation Fund for Small Technology-based Firms
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Li, Dl., Chen, Rh. Selective separation of copper by membrane-electro-winning and its application in etchant recycling. J Cent. South Univ. Technol. 12 (Suppl 1), 94–97 (2005). https://doi.org/10.1007/s11771-005-0379-0
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DOI: https://doi.org/10.1007/s11771-005-0379-0