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Effects of Ge on Microstructure, Spreadability, and Mechanical Properties of the Sn-32Pb-18Cd Solder Alloy

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Abstract

In this paper, the effects of xGe (x = 0, 0.002, 0.005, 0.01%) on the melting point, spreadability, wettability, microstructure, and mechanical properties of Sn-32Pb-18Cd solder alloys were investigated. The experiment results showed that the addition of Ge could increase the spreading area and wetting properties. The microstructures of solder alloy after reflowing were mainly composed of Pb phase and β-Sn phases, and the Cd element was distributed in the matrix. The addition of Ge could enhance the tensile strength and ductility. When the Ge content was equal to 0.005%, the maximum elongation reached 53.70%.

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Acknowledgments

The authors gratefully acknowledge the support of this research from the National Key Research and Development Program of China (2017YFB1104803).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, People’s Republic of China

    Kangli Li, Jian Lin, Tongju Wang, Yongping Lei & Hanguang Fu

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  1. Kangli Li
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  2. Jian Lin
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Correspondence to Jian Lin.

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Li, K., Lin, J., Wang, T. et al. Effects of Ge on Microstructure, Spreadability, and Mechanical Properties of the Sn-32Pb-18Cd Solder Alloy. J. of Materi Eng and Perform 29, 4541–4548 (2020). https://doi.org/10.1007/s11665-020-04958-9

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  • DOI: https://doi.org/10.1007/s11665-020-04958-9

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