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Effect of Sb Additions on the Creep Behaviour of Bi Containing SAC Alloys

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Abstract

Creep behaviour as well as microstructural evolution resulting from long-term isothermal treatment of cast Sn-3Ag-3Bi-0.5Cu-(0.6–5)Sb solder alloys for electronic packaging applications are investigated. Mechanisms of deformation are evaluated via creep tests conducted at a temperature range of 25–150°C using 7.5–12.5 MPa stress and in-depth scanning electron microscopy analysis. Short primary creep stages (< 1 h), an indication of low work hardening, followed by the secondary creep stage occurred in all conditions. Dislocation processes were found to control creep deformation above 100°C. Increase in Sb content has negligible effect on minimum creep rates but does affect the duration of secondary creep stage. A change in activation energy of creep deformation is determined at temperatures below 100°C.

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Acknowledgments

This project was conducted under MITACs Accelerate Project Grant G244961 MITACS IT08496. The authors thank Dr. Amir Farkoosh and Luis Angel Villegas Armenta for conducting the FactSage calculations, and Mr. Yuan Xu for technical support.

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Authors and Affiliations

  1. Mining and Materials Engineering, McGill University, 3610 University St, Wong Bldg, Rm 2140, Montreal, QC, H3A 2B2, Canada

    M. Celikin & M. Pekguleryuz

  2. Department of Research and Development, AIM Solder, Montreal, Canada

    M. Maalekian

  3. UCD School of Mechanical and Materials Engineering, University College Dublin, Belfield, Dublin 4, Ireland

    M. Celikin

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  1. M. Celikin
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  2. M. Maalekian
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  3. M. Pekguleryuz
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Correspondence to M. Celikin.

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Celikin, M., Maalekian, M. & Pekguleryuz, M. Effect of Sb Additions on the Creep Behaviour of Bi Containing SAC Alloys. J. Electron. Mater. 48, 5562–5569 (2019). https://doi.org/10.1007/s11664-019-07410-4

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  • DOI: https://doi.org/10.1007/s11664-019-07410-4

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