Abstract
The impact of thermal cure conditions on the mechanical and electrical properties of an epoxy cross-linked network incorporating a polynorbornene (PNB) dielectric polymer was studied. The cross-linking of the dielectric composition was achieved by an acid-catalyzed cationic cure reaction initiated by either thermal or photolytic activation of a photoacid generator. It is proposed that the observed mechanical and electrical properties of the fully cured polymer composition are the result of the development of a three-dimensional cross-linked network tying together the PNB polymer and multifunctional epoxy additives. The epoxy ring-opening reaction was measured using Fourier-transform infrared spectroscopy. The reduced modulus, internal film stress, dielectric constant, and swelling behavior of cross-linked films were studied as a function of curing temperature. Trends in the observed properties are explained by formation of a three-dimensional cross-linked network and degradation of the cross-links between the multifunctional epoxy additives at high temperature. It was also found that exposure of the film to aqueous base plays a role in the cure process and has a positive effect on the final properties. The optimum values of modulus, dielectric constant, residual stress, and moisture content were found for films cured at 160°C for 1 h. This relatively low cure temperature is potentially advantageous in device assembly and processing.
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Raeis-Zadeh, M., Melendez, N.D., Chen, YC. et al. Aqueous-Develop, Photosensitive Polynorbornene Dielectric: Optimization of Mechanical and Electrical Properties. J. Electron. Mater. 40, 2126–2138 (2011). https://doi.org/10.1007/s11664-011-1704-z
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DOI: https://doi.org/10.1007/s11664-011-1704-z