Abstract
The quasi-in situ tensile test of copper-containing antibacterial stainless steel was carried out by Shimadzu AGS-100 KN universal testing machine. The digital image correlation (DIC) was used to analyze the surface damage of different tensile strains during the tensile process of copper-containing stainless steel, and the damage equations of large deformation area and small deformation area were established. The microstructure evolution of copper-containing antibacterial stainless steel was analyzed by electron backscatter diffraction (EBSD), X-ray diffractometer (XRD), and transmission electron microscope (TEM). The experimental results show that as the strain increases, the LAGBs gradually increase, and the HAGBs and twins gradually decrease. Austenite and martensite cross each other, and some austenite are transformed into martensite. Dislocation slip affects twins, and twins continue to affect dislocation slip. The precipitation has pinning and hindering effects on dislocations and grain boundaries.
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Acknowledgments
The project was supported by the Fundamental Research Program of Shanxi Province (20210302123207 and 20210302124009), Scientific and Technological Innovation Programs of Higher Education Institutions in Shanxi (2021L292), Taiyuan University of Science and Technology Scientific Research Initial Funding (20212026), the Shanxi Outstanding Doctorate Award Funding Fund (20222042), Taiyuan University of Science and Technology Graduate Innovation Project (BY2022004 and SY2022088), and the Coordinative Innovation Center of Taiyuan Heavy Machinery Equipment.
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Li, J., Guo, S., Zhao, G. et al. Surface Damage and Microstructure Evolution of Copper-Containing Antibacterial Stainless Steel During Quasi-In Situ Tensile Process. Metall Mater Trans A (2024). https://doi.org/10.1007/s11661-024-07364-1
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DOI: https://doi.org/10.1007/s11661-024-07364-1