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Interfacial Reactions, Microstructure, and Strength of Sn-8Zn-3Bi and Sn-9Zn-Al Solder on Cu and Au/Ni (P) Pads

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Abstract

The Sn-8Zn-3Bi and Sn-9Zn-Al Pb-free solders were used to mount passive components onto printed circuit boards (PCBs) with electroless Ni immersed Au (ENIG) finishing layers using a reflow soldering process. The component mounted boards were aged at 150 °C for 200 to 1100 hours. The interfacial reactions and microstructure of the interfaces between the solders and the pads were observed using scanning electron microscopy and energy-dispersive spectrometry (EDS). Both solder joints on the two pads had similar interfacial microstructures; i.e., a very thin γ 2-AuZn3 layer was formed at the interface of the solder and Ni-P layer. The γ 2-AuZn3 layer transformed to an ε-AuZn8 intermetallic compounds (IMC) with a consistent thickness during aging. Zinc atoms redeposited onto the IMC layer increased with increasing aging time. After aging at 150 °C for various times, the shear strengths of the ENIG and organic solderability preservative (OSP) joints were evaluated. The shear strength of the Sn-8Zn-3Bi solder joint was better than that of the Sn-9Zn-Al solder joint. All of the solder joints deteriorated after aging; however, the degradations of the OSP solder joints were more evident than those of the ENIG solder joints.

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Notes

  1. JEOL is a trademark of Japan Electron Optics Ltd., Tokyo.

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Acknowledgments

This work was supported by the Taiwan National Science Council, Taipei, Taiwan under Contract No. 97-2221-E-239-005-MY3, which is gratefully acknowledged. Experimental assistance and suggestions from Professor M.P. Hung and Dr. Chih-Yao Liu of National Cheng Kung University are sincerely appreciated.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National United University, Kung-Ching Li, Miaoli, 36003, Taiwan R.O.C.

    Chi-Shiung Hsi (Professor) & Ching-Tsung Lin (Engineer)

  2. Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, Hsinchu, 31040, Taiwan R.O.C.

    Ching-Tsung Lin (Engineer), Tao-Chih Chang (Engineer) & Ming-Kann Liang (Engineer)

  3. Department of Fragrance and Cosmetic Science, Kaohsiung Medical University, Kaohsiung, 807, Taiwan R.O.C.

    Moo-Chin Wang (Professor)

Authors
  1. Chi-Shiung Hsi
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  2. Ching-Tsung Lin
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  3. Tao-Chih Chang
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Correspondence to Moo-Chin Wang.

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Manuscript submitted May 25, 2009.

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Hsi, CS., Lin, CT., Chang, TC. et al. Interfacial Reactions, Microstructure, and Strength of Sn-8Zn-3Bi and Sn-9Zn-Al Solder on Cu and Au/Ni (P) Pads. Metall Mater Trans A 41, 275–284 (2010). https://doi.org/10.1007/s11661-009-0109-6

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