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Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads

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Abstract

During the reflow process of Sn-8Zn-20In solder joints in the ball grid array (BGA) packages with Au/Ni/Cu and Ag/Cu pads, the Au and Ag thin films react with liquid solder to form γ3-AuZn4/γ-Au7Zn18 and ε-AgZn6 intermetallics, respectively. The γ3/γ intermetallic layer is prone to floating away from the solder/Ni interface, and the appearance of any interfacial intermetallics cannot be observed in the Au/Ni surface finished Sn-8Zn-20In packages during further aging treatments at 75°C and 115°C. In contrast, ε-CuZn5/γ-Cu5Zn8 intermetallics are formed at the aged Sn-8Zn-20In/Cu interface of the immersion Ag BGA packages. Bonding strengths of 3.8N and 4.0N are found in the reflowed Sn-8Zn-20In solder joints with Au/Ni/Cu and Ag/Cu pads, respectively. Aging at 75°C and 115°C gives slight increases of ball shear strength for both cases.

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Authors and Affiliations

  1. Institute of Materials Science and Engineering, National Taiwan University, 106, Taipei, Taiwan

    Yu-Chih Liu, Wei-Hong Lin, Hsiu-Jen Lin & Tung-Han Chuang

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  1. Yu-Chih Liu
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  2. Wei-Hong Lin
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  3. Hsiu-Jen Lin
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  4. Tung-Han Chuang
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Liu, YC., Lin, WH., Lin, HJ. et al. Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads. J. Electron. Mater. 35, 147–153 (2006). https://doi.org/10.1007/s11664-006-0197-7

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  • DOI: https://doi.org/10.1007/s11664-006-0197-7

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