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Influence of Grain Boundary Character on Creep Void Formation in Alloy 617

  • Symposium: Materials for the Nuclear Renaissance
  • Published:
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Abstract

Alloy 617, a high-temperature creep-resistant, nickel-based alloy, is being considered for the primary heat exchanger for the Next Generation Nuclear Plant (NGNP), which will operate at temperatures exceeding 760 °C and a helium pressure of approximately 7 MPa. Observations of the crept microstructure using optical microscopy indicate creep stress does not significantly influence the creep void fraction at a given creep strain over the relatively narrow set of creep conditions studied. Void formation was found to occur only after significant creep in the tertiary regime (>5 pct total creep strain) had occurred. Also, orientation imaging microscopy (OIM) was used to characterize the grain boundaries in the vicinity of creep voids that develop during high-temperature creep tests (900 °C to 1000 °C at creep stresses ranging from 20 to 40 MPa) terminated at creep strains ranging from 5 to 40 pct. Preliminary analysis of the OIM data indicates voids tend to form on grain boundaries parallel, perpendicular, or 45 deg to the tensile axis, while few voids are found at intermediate inclinations to the tensile axis. Random grain boundaries intersect most voids, while coincident site lattice (CSL)–related grain boundaries did not appear to be consistently associated with void development. Similar results were found in oxygen-free, high-conductivity (OFHC) copper, severely deformed using equal channel angular extrusion, and creep tested at 450 °C and 14 MPa.

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Notes

  1. INCONEL is a trademark of Special Metals Corporation, Huntington, WV.

  2. PHILIPS is a trademark of Philips Electronic Instruments, Mahwah, NJ.

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Acknowledgments

This work was supported by the United States Department of Energy, Office of Nuclear Energy, under the DOE Idaho Operations Office, Contract No. DE-AC07-05ID14517.

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Author notes

  1. Scott Schlegel (Graduate Student, Process Development Engineer)

    Present address: ATI Wah Chang, Albany, OR, 97321, USA

Authors and Affiliations

  1. Idaho National Laboratory, Idaho Falls, ID, 83415, USA

    Thomas Lillo (Senior Staff Scientist) & James Cole (Senior Staff Scientist)

  2. Materials Science and Engineering Department, Boise State University, Boise, ID, 83725-2075, USA

    Megan Frary (Assistant Professor) & Scott Schlegel (Graduate Student, Process Development Engineer)

Authors
  1. Thomas Lillo
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  2. James Cole
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  3. Megan Frary
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  4. Scott Schlegel
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Corresponding author

Correspondence to Thomas Lillo.

Additional information

This article is based on a presentation given in the symposium “Materials for the Nuclear Renaissance,” which occurred during the TMS Annual Meeting, February 15–19, 2009, in San Francisco, CA, under the auspices of Corrosion and Environmental Effects and the Nuclear Materials Committees of ASM-TMS.

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Lillo, T., Cole, J., Frary, M. et al. Influence of Grain Boundary Character on Creep Void Formation in Alloy 617. Metall Mater Trans A 40, 2803–2811 (2009). https://doi.org/10.1007/s11661-009-0051-7

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  • DOI: https://doi.org/10.1007/s11661-009-0051-7

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