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Low-Pressure Plasma Reactor with a Cylindrical Electrode for Eco-friendly Processing in the Semiconductor Industry

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Abstract

Thin film deposition processes emit large amounts of NF3 and by-product particles, which are of great concerns in the semiconductor industry, from the environmental and economic points of view. With an objective to overcome these concerns, plasmas are generated from a cylindrical reactor placed before a vacuum pump. The discharge stability is evaluated by monitoring the changes in the plasma images with the pressure. By using a particle sampler and a particle trap, the size and quantity of the by-product particles are compared during plasma-on and plasma-off. The effects of adding O2 and H2O to the by-products of the NF3 abatement process are investigated by analyzing the spectra obtained with a Fourier transform infrared spectroscopy. Further, the H2O flow rate is optimized for the highest destruction and removal efficiency of NF3. Finally, the applicability of our device to the after-treatment equipment is discussed.

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Acknowledgments

This work is supported by the Korea Research Council for Industrial Science & Technology.

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Authors and Affiliations

  1. Plasma Engineering Laboratory, Korea Institute of Machinery and Materials, 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon, 305-343, Korea

    M. Hur, J. O. Lee, W. S. Kang & Y.-H. Song

Authors
  1. M. Hur
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  2. J. O. Lee
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  3. W. S. Kang
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  4. Y.-H. Song
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Correspondence to M. Hur.

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Hur, M., Lee, J.O., Kang, W.S. et al. Low-Pressure Plasma Reactor with a Cylindrical Electrode for Eco-friendly Processing in the Semiconductor Industry. Plasma Chem Plasma Process 34, 1187–1198 (2014). https://doi.org/10.1007/s11090-014-9554-0

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  • DOI: https://doi.org/10.1007/s11090-014-9554-0

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