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Transient liquid phase infiltration bonding of copper using porous silver insert sheet

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Abstract

A transient liquid-phase infiltration process was successfully applied to the bonding of Cu using a porous Ag insert sheet. Ag particles with a mean size of ϕ2 μm were sintered to form Ag sheets with a porosity of 24 vol%. The sintered Ag sheet had an open-cell structure, and the molten Sn–Ag–Cu solder infiltrated the pores through capillary action, bonding the Cu rods and Cu plates. The pores in the Ag sheet are completely filled with the infiltrated molten Sn alloy. The Ag skeleton dissolved in the molten Sn alloy and solidified isothermally to form Ag3Sn, which gradually closed the pores. A Cu–Sn intermetallic compound layer was formed at the interface between the bond layer and the base Cu. A sound joint with a high remelting point and shear strength of approximately 46 MPa was obtained with a short bond time and relatively low bonding pressure. As the Cu–Sn intermetallic compound layer grew, the joint strength decreased.

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Acknowledgements

The authors would like to thank Shintaro Kuroiwa for his experimental assistance.

Funding

This work was supported by JSPS KAKENHI (Grant Number 21H01636).

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Authors and Affiliations

  1. Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka, 565-0871, Japan

    Shinji Fukumoto, Ryota Yagane & Michiya Matsushima

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  1. Shinji Fukumoto
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  2. Ryota Yagane
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  3. Michiya Matsushima
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Contributions

SF: Supervision, writing and review and editing, project administration. RY: Investigation, experimental, writing original draft. MM: Co-supervision and review.

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Correspondence to Shinji Fukumoto.

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Fukumoto, S., Yagane, R. & Matsushima, M. Transient liquid phase infiltration bonding of copper using porous silver insert sheet. J Mater Sci: Mater Electron 34, 1485 (2023). https://doi.org/10.1007/s10854-023-10895-9

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